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AM29DS323DT120WMIN PDF预览

AM29DS323DT120WMIN

更新时间: 2024-11-19 20:29:35
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
56页 1052K
描述
Flash, 2MX16, 120ns, PBGA48, 6 X 12 MM, 0.80 MM PITCH, FBGA-48

AM29DS323DT120WMIN 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:6 X 12 MM, 0.80 MM PITCH, FBGA-48
针数:48Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.21Is Samacsys:N
最长访问时间:120 ns备用内存宽度:8
启动块:TOPJESD-30 代码:R-PBGA-B48
JESD-609代码:e0长度:12 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:16湿度敏感等级:3
功能数量:1端子数量:48
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:2MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):240
编程电压:1.8 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):2.2 V
最小供电电压 (Vsup):1.8 V标称供电电压 (Vsup):2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
类型:NOR TYPE宽度:6 mm
Base Number Matches:1

AM29DS323DT120WMIN 数据手册

 浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第2页浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第3页浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第4页浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第5页浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第6页浏览型号AM29DS323DT120WMIN的Datasheet PDF文件第7页 
Am29DS323D  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. Please contact a Spansion repre-  
sentative for alternates.  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal data sheet improvement and are noted in the  
document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 23480 Revision A Amendment 5 Issue Date October 10, 2006  

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