D A T A S H E E T
TABLE OF CONTENTS
Sector Erase Command Sequence ..............................................27
Erase Suspend/Erase Resume Commands ................................28
Figure 4. Erase Operation .................................................................... 28
Command Definitions ................................................................... 29
Table 14. Am29DL16xD Command Definitions .................................... 29
Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
DQ7: Data# Polling ......................................................................30
Figure 5. Data# Polling Algorithm......................................................... 30
RY/BY#: Ready/Busy# ................................................................. 31
DQ6: Toggle Bit I ..........................................................................31
Figure 6. Toggle Bit Algorithm .............................................................. 31
DQ2: Toggle Bit II .........................................................................32
Reading Toggle Bits DQ6/DQ2 ....................................................32
DQ5: Exceeded Timing Limits ......................................................32
DQ3: Sector Erase Timer .............................................................32
Table 15. Write Operation Status ......................................................... 33
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
Figure 7. Maximum Negative Overshoot Waveform............................. 34
Figure 8. Maximum Positive Overshoot Waveform ............................. 34
Operating Ranges. . . . . . . . . . . . . . . . . . . . . . . . . 34
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7
Special Package Handling Instructions ..........................................9
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Ordering Information . . . . . . . . . . . . . . . . . . . . . . 11
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 12
Table 1. Am29DL16xD Device Bus Operations ....................................12
Word/Byte Configuration .............................................................. 12
Requirements for Reading Array Data .........................................12
Writing Commands/Command Sequences ..................................13
Accelerated Program Operation ...............................................13
Autoselect Functions .................................................................13
Simultaneous Read/Write Operations with Zero Latency ............13
Standby Mode .............................................................................. 13
Automatic Sleep Mode .................................................................13
RESET#: Hardware Reset Pin .....................................................14
Output Disable Mode ...................................................................14
Table 2. Am29DL16xD Device Bank Divisions .....................................14
Table 3. Sector Addresses for Top Boot Sector Devices ......................15
Table 4. Secured Silicon™ Sector Addresses for Top Boot Devices... 15
Table 5. Sector Addresses for Bottom Boot Sector Devices .................16
Table 6. Secured Silicon™ Addresses for Bottom Boot Devices......... 16
Autoselect Mode .......................................................................... 17
Table 7. Am29DL16xD Autoselect Codes, (High Voltage Method) ......17
Sector/Sector Block Protection and Unprotection ........................ 18
Table 8. Top Boot Sector/Sector Block Addresses
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 9. ICC1 Current vs. Time (Showing Active and Automatic
Sleep Currents)..................................................................................... 36
Figure 10. Typical ICC1 vs. Frequency................................................... 36
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 11. Test Setup .......................................................................... 37
Table 16. Test Specifications ................................................................ 37
Key To Switching Waveforms ......................................................37
Figure 12. Input Waveforms and Measurement Levels........................ 37
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 13. Read Operation Timings...................................................... 38
Figure 14. Reset Timings...................................................................... 39
Word/Byte Configuration (BYTE#) ...............................................40
Figure 15. BYTE# Timings for Read Operations .................................. 40
Figure 16. BYTE# Timings for Write Operations .................................. 40
Erase and Program Operations ...................................................41
Figure 17. Program Operation Timings ................................................ 42
Figure 18. Accelerated Program Timing Diagram ................................ 42
Figure 19. Chip/Sector Erase Operation Timings................................. 43
Figure 20. Back-to-back Read/Write Cycle Timings............................. 44
Figure 21. Data# Polling Timings (During Embedded Algorithms) ....... 44
Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 45
Figure 23. DQ2 vs. DQ6 ....................................................................... 45
Temporary Sector/Sector Block Unprotect ...................................46
Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram 46
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 47
Alternate CE# Controlled Erase and Program Operations ...........48
Figure 26. Alternate CE# Controlled Write (Erase/Program)
for Protection/Unprotection ...................................................................18
Table 9. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...................................................................18
Write Protect (WP#) .....................................................................19
Temporary Sector/Sector Block Unprotect ...................................19
Figure 1. Temporary Sector Unprotect Operation................................. 19
Figure 2. In-System Sector/Sector Block Protection and
Unprotection Algorithms........................................................................ 20
Secured Silicon Sector Flash Memory Region .............................21
Factory Locked: Secured Silicon Sector Programmed and
Protected At the Factory ...........................................................21
Customer Lockable: Secured Silicon Sector NOT Programmed or
Protected At the Factory ...........................................................21
Hardware Data Protection ............................................................21
Low VCC Write Inhibit ...............................................................22
Write Pulse “Glitch” Protection ..................................................22
Logical Inhibit ............................................................................22
Power-Up Write Inhibit ..............................................................22
Common Flash Memory Interface (CFI) . . . . . . . 22
Table 10. CFI Query Identification String.............................................. 22
Table 11. System Interface String......................................................... 23
Table 12. Device Geometry Definition .................................................. 23
Table 13. Primary Vendor-Specific Extended Query ............................ 24
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ......................................................................25
Reset Command ..........................................................................25
Autoselect Command Sequence ..................................................25
Enter Secured Silicon™ Sector/Exit Secured Silicon Sector Com-
mand Sequence ...........................................................................26
Byte/Word Program Command Sequence ...................................26
Unlock Bypass Command Sequence .......................................26
Figure 3. Program Operation ................................................................ 27
Chip Erase Command Sequence .................................................27
Operation Timings ................................................................................ 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50
Package and Pin Capacitance . . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
FBC048—48-Ball Fine-Pitch Ball Grid Array
8 x 9 mm package ........................................................................51
LAA064—64-Ball Fortified Ball Grid Array,
13 x 11 mm package ....................................................................52
TS 048—48-Pin Standard TSOP .................................................53
VBF048—48-Ball Very Thin Profile Fine-Pitch Ball Grid Array ....54
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
February 26, 2009 21533E6
Am29DL16xD
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