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AM1806ZCEA4 PDF预览

AM1806ZCEA4

更新时间: 2022-12-19 11:05:17
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德州仪器 - TI 微处理器
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AM1806 ARM Microprocessor

AM1806ZCEA4 数据手册

 浏览型号AM1806ZCEA4的Datasheet PDF文件第235页浏览型号AM1806ZCEA4的Datasheet PDF文件第236页浏览型号AM1806ZCEA4的Datasheet PDF文件第237页浏览型号AM1806ZCEA4的Datasheet PDF文件第238页浏览型号AM1806ZCEA4的Datasheet PDF文件第240页浏览型号AM1806ZCEA4的Datasheet PDF文件第241页 
AM1806  
www.ti.com  
SPRS658BFEBRUARY 2010REVISED MAY 2010  
8.3 Thermal Data for ZWT Package  
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical  
package.  
Table 8-2. Thermal Resistance Characteristics (PBGA Package) [ZWT]  
NO.  
1
°C/W(1)  
7.3  
AIR FLOW (m/s)(2)  
RΘJC  
RΘJB  
RΘJA  
Junction-to-case  
Junction-to-board  
Junction-to-free air  
N/A  
N /A  
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
0.00  
0.50  
1.00  
2.00  
4.00  
2
12.4  
23.7  
21.0  
20.1  
19.3  
18.4  
0.2  
3
4
5
RΘJMA  
Junction-to-moving air  
6
7
8
9
0.3  
10  
11  
12  
13  
14  
15  
16  
17  
PsiJT  
Junction-to-package top  
0.3  
0.4  
0.5  
12.3  
12.2  
12.1  
12.0  
11.9  
PsiJB  
Junction-to-board  
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.  
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment  
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount  
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and  
1.5oz (50um) inner copper thickness  
(2) m/s = meters per second  
Copyright © 2010, Texas Instruments Incorporated  
Mechanical Packaging and Orderable Information  
Submit Documentation Feedback  
Product Folder Link(s): AM1806  
239  

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