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AM1802EZWTD3 PDF预览

AM1802EZWTD3

更新时间: 2024-11-25 11:06:27
品牌 Logo 应用领域
德州仪器 - TI 以太网时钟双倍数据速率光电二极管外围集成电路
页数 文件大小 规格书
180页 1235K
描述
Sitara 处理器:Arm9,LPDDR,DDR2,以太网 | ZWT | 361 | -40 to 90

AM1802EZWTD3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:LFBGA,
Reach Compliance Code:compliantECCN代码:3A991A2
Factory Lead Time:6 weeks风险等级:1.73
地址总线宽度:23位大小:32
边界扫描:YES最大时钟频率:30 MHz
外部数据总线宽度:16格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B361
JESD-609代码:e1长度:16 mm
低功率模式:YES湿度敏感等级:3
DMA 通道数量:80端子数量:361
片上数据RAM宽度:8最高工作温度:90 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
RAM(字数):172032座面最大高度:1.4 mm
速度:300 MHz最大供电电压:1.32 V
最小供电电压:1.14 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:16 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

AM1802EZWTD3 数据手册

 浏览型号AM1802EZWTD3的Datasheet PDF文件第2页浏览型号AM1802EZWTD3的Datasheet PDF文件第3页浏览型号AM1802EZWTD3的Datasheet PDF文件第4页浏览型号AM1802EZWTD3的Datasheet PDF文件第5页浏览型号AM1802EZWTD3的Datasheet PDF文件第6页浏览型号AM1802EZWTD3的Datasheet PDF文件第7页 
AM1802  
www.ti.com  
SPRS710C NOVEMBER 2010REVISED MARCH 2012  
AM1802 ARM Microprocessor  
Check for Samples: AM1802  
1 Device Summary  
1.1 Features  
12  
NOR (8-/16-Bit-Wide Data)  
NAND (8-/16-Bit-Wide Data)  
16-Bit SDRAM With 128 MB Address  
Space  
• Highlights  
– 300-MHz ARM926EJ-S™ RISC Core  
– ARM9 Memory Architecture  
– Enhanced Direct-Memory-Access Controller  
3 (EDMA3)  
– DDR2/Mobile DDR Memory Controller  
16-Bit DDR2 SDRAM With 512 MB  
Address Space or  
16-Bit mDDR SDRAM With 256 MB  
Address Space  
– Two External Memory Interfaces  
– Three Configurable 16550 type UART  
Modules  
– Two Serial Peripheral Interfaces (SPI)  
• Three Configurable 16550 type UART Modules:  
– With Modem Control Signals  
– 16-byte FIFO  
– 16x or 13x Oversampling Option  
• Two Serial Peripheral Interfaces (SPI) Each  
With Multiple Chip-Selects  
• One Multimedia Card (MMC)/Secure Digital (SD)  
Card Interface with Secure Data I/O (SDIO)  
Interfaces  
• One Master/Slave Inter-Integrated Circuit (I2C  
Bus™)  
– Multimedia Card (MMC)/Secure Digital (SD)  
Card Interface with Secure Data I/O (SDIO)  
– One Master/Slave Inter-Integrated Circuit  
– USB 2.0 OTG Port With Integrated PHY  
– One Multichannel Audio Serial Port  
– 10/100 Mb/s Ethernet MAC (EMAC)  
– Three 64-Bit General-Purpose Timers  
– One 64-bit General-Purpose/Watchdog Timer  
• 300-MHz ARM926EJ-S RISC MPU  
• ARM926EJ-S Core  
• USB 2.0 OTG Port With Integrated PHY (USB0)  
– USB 2.0 High-/Full-Speed Client  
– USB 2.0 High-/Full-/Low-Speed Host  
– End Point 0 (Control)  
– End Points 1,2,3,4 (Control, Bulk, Interrupt or  
ISOC) Rx and Tx  
• One Multichannel Audio Serial Port:  
– Transmit/Receive Clocks  
– 32-Bit and 16-Bit (Thumb®) Instructions  
– Single Cycle MAC  
– ARM® Jazelle® Technology  
– EmbeddedICE-RT™ for Real-Time Debug  
• ARM9 Memory Architecture  
– 16K-Byte Instruction Cache  
– 16K-Byte Data Cache  
– Two Clock Zones and 16 Serial Data Pins  
– Supports TDM, I2S, and Similar Formats  
– DIT-Capable  
– 8K-Byte RAM (Vector Table)  
– 64K-Byte ROM  
• Enhanced Direct-Memory-Access Controller 3  
(EDMA3):  
– FIFO buffers for Transmit and Receive  
• 10/100 Mb/s Ethernet MAC (EMAC):  
– IEEE 802.3 Compliant  
– 2 Channel Controllers  
– 3 Transfer Controllers  
– 64 Independent DMA Channels  
– 16 Quick DMA Channels  
– MII Media Independent Interface  
– RMII Reduced Media Independent Interface  
– Management Data I/O (MDIO) Module  
– Programmable Transfer Burst Size  
• 128K-Byte On-chip Memory  
• Real-Time Clock With 32-kHz Oscillator and  
Separate Power Rail  
• 1.8V or 3.3V LVCMOS IOs (except for USB and  
DDR2 interfaces)  
• Three 64-Bit General-Purpose Timers (Each  
Configurable as Two 32-Bit Timers)  
• Two External Memory Interfaces:  
• One 64-Bit General-Purpose/Watchdog Timer  
(Configurable as Two 32-Bit General-Purpose  
– EMIFA  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
2
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2010–2012, Texas Instruments Incorporated  
 

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