Revision 13
IGLOOe Low Power Flash FPGAs
with Flash*Freeze Technology
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•
Bank-Selectable I/O Voltages—Up to 8 Banks per Chip
Features and Benefits
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and
LVCMOS 2.5 V / 5.0 V Input
Low Power
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•
•
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1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
Low-Power Active FPGA Operation
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•
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold-Sparing I/Os
Flash*Freeze
Technology
Enables
Ultra-Low
Power
Consumption while Maintaining FPGA Content
Flash*Freeze Pin Allows Easy Entry to / Exit from Ultra-Low-
Power Flash*Freeze Mode
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•
•
High Capacity
•
•
•
600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 620 User I/Os
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•
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Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
Reprogrammable Flash Technology
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
•
•
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Instant On Level 0 Support
IEEE 1149.1 (JTAG) Boundary Scan Test
®
Single-Chip Solution
Pin-Compatible Packages across the IGLOO e Family
Retains Programmed Design when Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
Clock Conditioning Circuit (CCC) and PLL
•
•
Six CCC Blocks, Each with an Integrated PLL
Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
In-System Programming (ISP) and Security
•
ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
•
Wide Input Frequency Range (1.5 MHz up to 250 MHz)
®
Embedded Memory
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•
•
FlashLock Designed to Secure FPGA Contents
1 kbit of FlashROM User Nonvolatile Memory
High-Performance Routing Hierarchy
SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations available)
True Dual-Port SRAM (except ×18)
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Segmented, Hierarchical Routing and Clock Structure
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
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ARM Processor Support in IGLOOe FPGAs
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Pro (Professional) I/O
M1 IGLOOe Devices—Cortex™-M1 Soft Processor Available
with or without Debug
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•
700 Mbps DDR, LVDS-Capable I/Os
1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Table 1 • IGLOOe Product Family
IGLOOe Devices
AGLE600
AGLE3000
ARM-Enabled IGLOOe Devices
System Gates
M1AGLE3000
600,000
13,824
49
3,000,000
VersaTiles (D-flip-flops)
Quiescent Current (typical) in Flash*Freeze Mode (µW)
RAM kbits (1,024 bits)
4,608-Bit Blocks
75,264
137
504
112
1
108
24
FlashROM Kbits (1,024 bits)
Secure (AES) ISP
1
Yes
6
Yes
6
CCCs with Integrated PLLs
VersaNet Globals 1
18
18
8
I/O Banks
8
Maximum User I/Os
270
620
Package Pins
FBGA
FG256, FG484
FG484, FG896
Notes:
1. Refer to the Cortex-M1 Handbook for more information.
2. Six chip (main) and twelve quadrant global networks are available.
3. For devices supporting lower densities, refer to the IGLOO Low-Power Flash FPGAs with Flash*Freeze Technology datasheet.
December 2012
I
© 2012 Microsemi Corporation