5秒后页面跳转
捷配首页

Datasheet > 暂无类别数据> AFS250-FG256I
AFS250-FG256I PDF预览

AFS250-FG256I

更新时间： 2024-11-09 12:55:03
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
334页 18780K
描述
Fusion Family of Mixed Signal FPGAs

阅读下载

中文翻译

获取价格

AFS250-FG256I 技术参数

是否Rohs认证：不符合生命周期：Active
包装说明：LBGA,Reach Compliance Code：compliant
ECCN代码：3A001.A.7.AHTS代码：8542.39.00.01
风险等级：5.83Is Samacsys：N
JESD-30 代码：S-PBGA-B256JESD-609代码：e0
长度：17 mm湿度敏感等级：3
可配置逻辑块数量：6144等效关口数量：250000
端子数量：256最高工作温度：85 °C
最低工作温度：-40 °C组织：6144 CLBS, 250000 GATES
封装主体材料：PLASTIC/EPOXY封装代码：LBGA
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE
峰值回流温度（摄氏度）：225可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY
认证状态：Not Qualified座面最大高度：1.68 mm
最大供电电压：1.575 V最小供电电压：1.425 V
标称供电电压：1.5 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn/Pb)端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：30宽度：17 mm
Base Number Matches：1

AFS250-FG256I 数据手册

 浏览型号AFS250-FG256I的Datasheet PDF文件第2页浏览型号AFS250-FG256I的Datasheet PDF文件第3页浏览型号AFS250-FG256I的Datasheet PDF文件第4页浏览型号AFS250-FG256I的Datasheet PDF文件第5页浏览型号AFS250-FG256I的Datasheet PDF文件第6页浏览型号AFS250-FG256I的Datasheet PDF文件第7页 
Revision 4  
Fusion Family of Mixed Signal FPGAs  
In-System Programming (ISP) and Security  
Features and Benefits  
•
•
ISP with 128-Bit AES via JTAG  
®
High-Performance Reprogrammable Flash Technology  
FlashLock Designed to Protect FPGA Contents  
•
•
•
•
Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process  
Nonvolatile, Retains Program when Powered Off  
Instant On Single-Chip Solution  
Advanced Digital I/O  
•
•
•
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Bank-Selectable I/O Voltages – Up to 5 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS  
3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and  
LVCMOS 2.5 V / 5.0 V Input  
Differential I/O Standards: LVPECL, LVDS, B-LVDS, M-LVDS  
– Built-In I/O Registers  
– 700 Mbps DDR Operation  
Hot-Swappable I/Os  
350 MHz System Performance  
Embedded Flash Memory  
•
User Flash Memory – 2 Mbits to 8 Mbits  
– Configurable 8-, 16-, or 32-Bit Datapath  
– 10 ns Access in Read-Ahead Mode  
1 Kbit of Additional FlashROM  
•
•
•
•
Integrated A/D Converter (ADC) and Analog I/O  
Programmable Output Slew Rate, Drive Strength, and Weak  
Pull-Up/Down Resistor  
Pin-Compatible Packages across the Fusion Family  
•
•
•
•
•
•
Up to 12-Bit Resolution and up to 600 Ksps  
Internal 2.56 V or External Reference Voltage  
ADC: Up to 30 Scalable Analog Input Channels  
High-Voltage Input Tolerance: –10.5 V to +12 V  
Current Monitor and Temperature Monitor Blocks  
Up to 10 MOSFET Gate Driver Outputs  
– P- and N-Channel Power MOSFET Support  
– Programmable 1, 3, 10, 30 µA, and 20 mA Drive Strengths  
ADC Accuracy is Better than 1%  
®
•
SRAMs and FIFOs  
•
Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,  
and ×18 organizations available)  
•
•
True Dual-Port SRAM (except ×18)  
Programmable Embedded FIFO Control Logic  
•
Soft ARM Cortex-M1 Fusion Devices (M1)  
®
On-Chip Clocking Support  
•
ARM Cortex-™M1–Enabled  
•
•
•
•
Internal 100 MHz RC Oscillator (accurate to 1%)  
Crystal Oscillator Support (32 KHz to 20 MHz)  
Pigeon Point ATCA IP Support (P1)  
®
•
Targeted to Pigeon Point Board Management Reference  
(BMR) Starter Kits  
Designed in Partnership with Pigeon Point Systems  
ARM Cortex-M1 Enabled  
Programmable Real-Time Counter (RTC)  
6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs  
– Phase Shift, Multiply/Divide, and Delay Capabilities  
– Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz  
•
•
MicroBlade Advanced Mezzanine Card Support (U1)  
Low Power Consumption  
•
•
•
•
•
Targeted to Advanced Mezzanine Card (AdvancedMC™ Designs)  
Designed in Partnership with MicroBlade  
8051-Based Module Management Controller (MMC)  
Single 3.3 V Power Supply with On-Chip 1.5 V Regulator  
Sleep and Standby Low-Power Modes  
Table 1 • Fusion Family  
Fusion Devices  
AFS090  
AFS250  
AFS600  
AFS1500  
*
ARM Cortex-M1 Devices  
M1AFS250  
M1AFS600  
M1AFS1500  
Pigeon Point Devices  
MicroBlade Devices  
P1AFS600  
P1AFS1500  
U1AFS250  
U1AFS600  
U1AFS1500  
System Gates  
90,000  
2,304  
Yes  
1
250,000  
600,000  
13,824  
Yes  
2
1,500,000  
38,400  
Yes  
2
Tiles (D-flip-flops)  
Secure (AES) ISP  
PLLs  
6,144  
Yes  
1
General  
Information  
Globals  
18  
18  
1
18  
18  
Flash Memory Blocks (2 Mbits)  
Total Flash Memory Bits  
FlashROM Bits  
1
2
4
2M  
1,024  
6
2M  
1,024  
8
4M  
1,024  
24  
8M  
Memory  
1,024  
60  
RAM Blocks (4,608 bits)  
RAM kbits  
27  
36  
6
108  
10  
270  
10  
Analog Quads  
5
Analog Input Channels  
Gate Driver Outputs  
I/O Banks (+ JTAG)  
Maximum Digital I/Os  
Analog I/Os  
15  
18  
6
30  
30  
5
10  
10  
Analog and I/Os  
4
4
5
5
75  
114  
24  
172  
40  
252  
40  
20  
Note: *Refer to the Cortex-M1 product brief for more information.  
January 2013  
I
© 2013 Microsemi Corporation  
1234567...334

中文翻译

下载PDF

与AFS250-FG256I相关器件

型号 品牌 获取价格 描述 数据表
AFS250-FG256PP MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG256PP ACTEL

获取价格

 		Actel Fusion Mixed-Signal FPGAs
AFS250-FG256Y MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG256YC MICROSEMI

获取价格

 		FPGA
AFS250-FG256YES MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG256YI MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG256YPP MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG484 MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG484ES MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs
AFS250-FG484I MICROSEMI

获取价格

 		Fusion Family of Mixed Signal FPGAs

与AFS250-FG256I相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证