是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FBGA-256 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.8 |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 17 mm | 湿度敏感等级: | 3 |
可配置逻辑块数量: | 6144 | 等效关口数量: | 250000 |
端子数量: | 256 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 6144 CLBS, 250000 GATES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE |
峰值回流温度(摄氏度): | 260 | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 1.68 mm |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 17 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
AFS250-1FGG484 | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484ES | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484I | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484PP | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484Y | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484YES | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484YI | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1FGG484YPP | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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AFS250-1PQ208GI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, |
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AFS250-1PQ256 | MICROSEMI |
获取价格 |
Fusion Family of Mixed Signal FPGAs |
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