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ADuM3221WARZ PDF预览

ADuM3221WARZ

更新时间: 2024-02-29 10:00:12
品牌 Logo 应用领域
亚德诺 - ADI 外围驱动器栅极驱动程序和接口接口集成电路光电二极管栅极驱动
页数 文件大小 规格书
16页 614K
描述
Isolated, 4 A Dual-Channel Gate Driver

ADuM3221WARZ 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active包装说明:SOP, SOP8,.25
针数:8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.55Is Samacsys:N
内置保护:TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE高边驱动器:NO
接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVERJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.9 mm
湿度敏感等级:3功能数量:2
端子数量:8最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流:0.23 A
标称输出峰值电流:4 A封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260筛选级别:AEC-Q100
座面最大高度:1.75 mm最大压摆率:17 mA
最大供电电压:5.5 V最小供电电压:3 V
标称供电电压:3.3 V电源电压1-最大:18 V
电源电压1-分钟:4.5 V电源电压1-Nom:10 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
断开时间:0.72 µs接通时间:0.72 µs
宽度:3.9 mmBase Number Matches:1

ADuM3221WARZ 数据手册

 浏览型号ADuM3221WARZ的Datasheet PDF文件第9页浏览型号ADuM3221WARZ的Datasheet PDF文件第10页浏览型号ADuM3221WARZ的Datasheet PDF文件第11页浏览型号ADuM3221WARZ的Datasheet PDF文件第13页浏览型号ADuM3221WARZ的Datasheet PDF文件第14页浏览型号ADuM3221WARZ的Datasheet PDF文件第15页 
ADuM3220/ADuM3221  
Data Sheet  
APPLICATIONS INFORMATION  
PC BOARD LAYOUT  
THERMAL LIMITATIONS AND SWITCH LOAD  
CHARACTERISTICS  
The ADuM3220/ADuM3221 digital isolators require no exter-  
nal interface circuitry for the logic interfaces. Power supply  
bypassing is required at the input and output supply pins, as  
shown in Figure 19. Use a small ceramic capacitor with a value  
from 0.01 µF to 0.1 µF to provide a good high frequency bypass.  
On the output power supply pin, VDD2, it is recommended that a  
10 µF capacitor also be added to provide the charge required to  
drive the gate capacitance at the ADuM3220/ADuM3221 outputs.  
On the output supply pin, the use of vias with the bypass capacitor  
should be avoided, or multiple vias should be used to reduce the  
inductance in the bypassing. The total lead length between both  
ends of the smaller capacitor and the input or output power  
supply pin should not exceed 20 mm.  
For isolated gate drivers, the necessary separation between the  
input and output circuits prevents the use of a single thermal pad  
beneath the part; therefore, heat is dissipated mainly through  
the package pins.  
Package thermal dissipation limits the performance of switching  
frequency vs. output load, as illustrated in Figure 8, which shows  
the maximum load capacitance that can be driven with a 1 Ω series  
gate resistor for different values of output voltage. For example,  
this curve shows that a typical ADuM3220/ADuM3221 can drive  
a large MOSFET with 120 nC gate charge at 8 V output (which is  
equivalent to a 15 nF load) up to a frequency of about 300 kHz.  
OUTPUT LOAD CHARACTERISTICS  
V
V
DD1  
DD2  
V
V
V
V
IA  
IB  
OA  
OB  
The ADuM3220/ADuM3221 output signals depend on the  
characteristics of the output load, which is typically an N-channel  
MOSFET. The driver output response to an N-channel MOSFET  
load can be modeled with a switch output resistance (RSW), an  
inductance due to the printed circuit board trace (LTRACE), a series  
gate resistor (RGATE), and a gate-to-source capacitance (CGS), as  
shown in Figure 21.  
GND  
GND  
1
2
Figure 19. Recommended PCB Layout  
PROPAGATION DELAY-RELATED PARAMETERS  
Propagation delay is a parameter that describes the time it takes a  
logic signal to propagate through a component. The propagation  
delay to a logic low output can differ from the propagation delay  
to a logic high output. The ADuM3220/ADuM3221 specify tDLH  
as the time between the input rising high logic threshold, VIH,  
and the output rising 10% threshold (see Figure 20). Likewise, the  
falling propagation delay, tDHL, is defined as the time between the  
input falling logic low threshold, VIL, and the output falling 90%  
threshold. The rise and fall times are dependent on the loading  
conditions and are not included in the propagation delay, as is  
the industry standard for gate drivers.  
R
R
SW  
GATE  
V
V
OA  
IA  
V
ADuM3220/  
ADuM3221  
O
L
TRACE  
C
GS  
Figure 21. RLC Model of the Gate of an N-Channel MOSFET  
RSW is the switch resistance of the internal ADuM3220/ADuM3221  
driver output, which is about 1.5 Ω. RGATE is the intrinsic gate  
resistance of the MOSFET and any external series resistance. A  
MOSFET that requires a 4 A gate driver has a typical intrinsic  
gate resistance of about 1 Ω and a gate-to-source capacitance,  
CGS, from 2 nF to 10 nF. LTRACE is the inductance of the printed  
circuit board trace, typically a value of 5 nH or less for a well-  
designed layout with a very short and wide connection from the  
ADuM3220/ADuM3221 output to the gate of the MOSFET.  
90%  
OUTPUT  
10%  
V
The following equation defines the Q factor of the RLC circuit,  
which indicates how the ADuM3220/ADuM3221 output responds  
to a step change. For a well-damped output, Q is less than 1.  
Adding a series gate resistor dampens the output response.  
IH  
INPUT  
V
IL  
tDHL  
tDLH  
tR  
tF  
LTRACE  
CGS  
1
Q =  
×
(RSW + RGATE  
)
Figure 20. Propagation Delay Parameters  
In Figure 5 and Figure 6, the ADuM3220/ADuM3221 output  
waveforms for 10 V output are shown for a CGS of 2 nF and 1 nF,  
respectively. Note the ringing of the output in Figure 6 with CGS  
of 1 nF and a calculated Q factor of 1.5, where less than 1 is  
desired for good damping.  
Channel-to-channel matching refers to the maximum amount  
that the propagation delay differs between channels within a  
single ADuM3220/ADuM3221 component.  
Propagation delay skew refers to the maximum amount that  
the propagation delay differs between multiple ADuM3220/  
ADuM3221 components operating under the same conditions.  
Rev. C | Page 12 of 16  
 
 
 
 
 
 
 
 

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