ADS131E04
ADS131E06
ADS131E08
SBAS561A –JUNE 2012–REVISED APRIL 2013
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ELECTRICAL CHARACTERISTICS (continued)
Minimum and maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications are
at DVDD = 1.8 V, AVDD = 3 V, AVSS = 0 V, VREF = 2.4 V, external fCLK = 2.048 MHz, data rate = 8 kSPS, and gain = 1,
unless otherwise noted.
ADS131E0x
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT (Operational Amplifier Turned Off)
AVDD – AVSS = 3 V
5.1
5.8
1
mA
mA
mA
mA
IAVDD
AVDD – AVSS = 5 V
DVDD = 3.3 V
Normal mode
IDVDD
DVDD = 1.8 V
0.4
POWER DISSIPATION (Analog Supply = 3 V)
Normal mode
9.3
10
2
10.2
13.5
17.6
mW
µW
ADS131E04
Power-down mode
Standby mode
Normal mode
mW
mW
µW
12.7
10
2
Quiescent power
ADS131E06
dissipation
Power-down mode
Standby mode
Normal mode
mW
mW
µW
16
10
2
ADS131E08
POWER DISSIPATION (Analog Supply = 5 V)
ADS131E04
Power-down mode
Standby mode
mW
Normal mode
18
20
mW
µW
Power-down mode
Standby mode
Normal mode
4.2
24.3
20
mW
mW
µW
Quiescent power
ADS131E06
dissipation
Power-down mode
Standby mode
Normal mode
4.2
29.7
20
mW
mW
µW
ADS131E08
Power-down mode
Standby mode
4.2
mW
TEMPERATURE
TA
Specified
Operating
Storage
–40
–40
–60
+105
+105
+150
°C
°C
°C
Temperature
range
TJ
Tstg
THERMAL INFORMATION
ADS131E0x
THERMAL METRIC(1)
PAG (TQFP)
UNITS
64 PINS
35
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
31
26
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.1
ψJB
NA
θJCbot
NA
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6
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