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ADS131B26-Q1 PDF预览

ADS131B26-Q1

更新时间: 2024-10-29 11:15:39
品牌 Logo 应用领域
德州仪器 - TI 电池监视器高压
页数 文件大小 规格书
8页 1111K
描述
用于检测电流和电压的汽车类、六个 ADC 通道、高压 SPI 电池包监视器

ADS131B26-Q1 数据手册

 浏览型号ADS131B26-Q1的Datasheet PDF文件第1页浏览型号ADS131B26-Q1的Datasheet PDF文件第2页浏览型号ADS131B26-Q1的Datasheet PDF文件第3页浏览型号ADS131B26-Q1的Datasheet PDF文件第5页浏览型号ADS131B26-Q1的Datasheet PDF文件第6页浏览型号ADS131B26-Q1的Datasheet PDF文件第7页 
ADS131B26-Q1  
ZHCSQY2 SEPTEMBER 2022  
www.ti.com.cn  
EXAMPLE BOARD LAYOUT  
PowerPADTM HTQFP - 1.2 mm max height  
PHP0048G  
PLASTIC QUAD FLATPACK  
( 6.5)  
NOTE 10  
(5.17)  
SYMM  
48  
37  
SOLDER MASK  
DEFINED PAD  
48X (1.6)  
1
36  
48X (0.3)  
SYMM  
49  
(5.17)  
(1.1 TYP)  
(8.5)  
44X (0.5)  
12  
25  
(R0.05) TYP  
(
0.2) TYP  
VIA  
METAL COVERED  
BY SOLDER MASK  
13  
24  
(1.1 TYP)  
SEE DETAILS  
(8.5)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:8X  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL  
EXPOSED METAL  
EXPOSED METAL  
METAL UNDER  
SOLDER MASK  
SOLDER MASK  
OPENING  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4225861/A 4/2020  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,  
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).  
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged  
or tented.  
10. Size of metal pad may vary due to creepage requirement.  
www.ti.com  
Copyright © 2022 Texas Instruments Incorporated  
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