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ADP170AUJZ-1.2-R7 PDF预览

ADP170AUJZ-1.2-R7

更新时间: 2024-10-28 12:27:59
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路光电二极管输出元件PC
页数 文件大小 规格书
20页 538K
描述
300 mA, Low Quiescent Current, CMOS Linear Regulators

ADP170AUJZ-1.2-R7 数据手册

 浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第11页浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第12页浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第13页浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第15页浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第16页浏览型号ADP170AUJZ-1.2-R7的Datasheet PDF文件第17页 
ADP170/ADP171  
CURRENT LIMIT AND THERMAL OVERLOAD  
PROTECTION  
The junction temperature of the ADP170/ADP171 can be  
calculated from the following equation:  
The ADP170/ADP171 are protected against damage due to  
excessive power dissipation by current and thermal overload  
protection circuits. The ADP170/ADP171 are designed to limit  
the current when the output load reaches 450 mA (typical).  
When the output load exceeds 450 mA, the output voltage is  
reduced to maintain a constant current limit.  
TJ = TA + (PD × θJA)  
(2)  
(3)  
where:  
TA is the ambient temperature.  
PD is the power dissipation in the die, given by  
PD = [(VIN VOUT) × ILOAD] + (VIN × IGND  
)
where:  
Thermal overload protection is included, which limits the junction  
temperature to a maximum of 150°C (typical). Under extreme  
conditions (that is, high ambient temperature and power dissip-  
ation), when the junction temperature starts to rise above 150°C,  
the output is turned off, reducing the output current to 0. When  
the junction temperature drops below 135°C, the output is turned  
on again and output current is restored to its nominal value.  
I
I
LOAD is the load current.  
GND is the ground current.  
V
IN and VOUT are input and output voltages, respectively.  
Power dissipation due to ground current is quite small and can  
be ignored. Therefore, the junction temperature equation  
simplifies to the following:  
Consider the case where a hard short from VOUT to GND occurs.  
At first, the ADP170/ADP171 will limit the current so that only  
450 mA is conducted into the short. If self-heating of the junction  
is great enough to cause its temperature to rise above 150°C,  
thermal shutdown will activate, turning off the output and  
reducing the output current to 0. As the junction temperature  
cools and drops below 135°C, the output turns on and conducts  
450 mA into the short, again causing the junction temperature  
to rise above 150°C. This thermal oscillation between 135°C  
and 150°C causes a current oscillation between 450 mA and 0 mA,  
which continues as long as the short remains at the output.  
TJ = TA + {[(VIN VOUT) × ILOAD] × θJA}  
(4)  
As shown in Equation 4, for a given ambient temperature, input  
to output voltage differential, and continuous load current,  
there exists a minimum copper size requirement for the PCB to  
ensure that the junction temperature does not rise above 125°C.  
Figure 33 to Figure 38 show junction temperature calculations  
for different ambient temperatures, load currents, VIN to VOUT  
differentials, and areas of PCB copper.  
140  
T
MAX  
J
120  
100  
80  
60  
40  
20  
0
I
= 300mA  
Current and thermal limit protections are intended to protect  
the device against accidental overload conditions.  
LOAD  
I
= 150mA  
LOAD  
THERMAL CONSIDERATIONS  
To guarantee reliable operation, the junction temperature of the  
ADP170/ADP171 must not exceed 125°C. To ensure the junction  
temperature stays below this maximum value, the user needs to  
be aware of the parameters that contribute to junction temperature  
changes. These parameters include ambient temperature, power  
dissipation in the power device, and thermal resistances between  
the junction and ambient air (θJA). The θJA number is dependent  
on the package assembly compounds used and the amount of  
copper to which the GND pin of the package is soldered on the  
PCB. Table 6 shows typical θJA values of the 5-lead TSOT package  
for various PCB copper sizes.  
I
= 100mA  
= 25mA  
LOAD  
I
LOAD  
I
= 10mA  
I
= 1mA  
1.5  
LOAD  
2.0  
LOAD  
0.5  
1.0  
2.5  
3.0  
V
– V (V)  
IN  
OUT  
Figure 33. 500 mm2 of PCB Copper, TA = 25°C  
140  
120  
100  
80  
T
MAX  
J
I
= 300mA  
LOAD  
Table 6. Typical θJA Values  
Copper Size (mm2)  
01  
θJA (°C/W)  
170  
I
= 150mA  
LOAD  
50  
152  
146  
134  
131  
60  
100  
300  
500  
I
= 100mA  
LOAD  
40  
I
= 25mA  
LOAD  
20  
1 Device soldered to minimum size pin traces.  
I
= 10mA  
LOAD  
I
= 1mA  
1.5  
LOAD  
0
0.5  
1.0  
2.0  
– V (V)  
2.5  
3.0  
V
OUT  
IN  
Figure 34. 100 mm2 of PCB Copper, TA = 25°C  
Rev. B | Page 14 of 20  
 
 
 

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