Datasheet > ADM7170

ADM7170

更新时间： 2022-02-26 10:14:46

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
24页	1026K
描述
Adjustable and fixed output voltage options

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ADM7170 数据手册

ADM7170

Data Sheet

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADM7170.

However, as listed in Table 7, a point of diminishing returns

is eventually reached, beyond which an increase in the copper

size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0805 or 1206 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 69. Example LFCSP PCB Layout

Rev. C | Page 22 of 23

1...20 21 222324

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