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ADM7170 PDF预览

ADM7170

更新时间: 2022-02-26 10:14:46
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
24页 1026K
描述
Adjustable and fixed output voltage options

ADM7170 数据手册

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Data Sheet  
ADM7170  
160  
150  
140  
130  
120  
110  
100  
90  
160  
140  
120  
100  
80  
60  
80  
T
T
T
T
T
= 25°C  
= 50°C  
= 65°C  
= 85°C  
MAX  
B
B
B
B
J
40  
2
6400mm  
70  
2
500mm  
20  
2
25mm  
60  
T
MAX  
J
50  
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4  
TOTAL POWER DISSIPATION (W)  
0
1
2
3
4
5
6
7
8
9
TOTAL POWER DISSIPATION (W)  
Figure 64. LFCSP, TA = 50°C  
Figure 66. LFCSP Power Dissipation for Various Board Temperatures  
155  
145  
135  
125  
115  
105  
95  
TYPICAL APPLICATIONS CIRCUITS  
HIGH  
ADM7170  
6.5V, 500mA  
LDO  
4V TO 6.5V  
3.3V  
SPEED  
CLOCK  
DRIVER  
Figure 67. Clock Driver  
ADM7170  
6.5V, 500mA  
LDO  
3.3V  
V
VCO  
4V TO 6.5V  
2
85  
6400mm  
D
VDD  
VDD  
2
500mm  
ADF4350  
75  
2
25mm  
ADM7170  
6.5V, 500mA  
LDO  
3.3V  
A
T
MAX  
J
65  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5  
TOTAL POWER DISSIPATION (W)  
Figure 68. RF PLL/VCO Power  
Figure 65. LFCSP, TA = 85°C  
In the case where the board temperature is known, use the  
thermal characterization parameter, ΨJB, to estimate the  
junction temperature rise. Maximum junction temperature (TJ)  
is calculated from the board temperature (TB) and power  
dissipation (PD) using the following formula:  
TJ = TB + (PD × ΨJB)  
(5)  
Rev. C | Page 21 of 23  
 
 

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