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ADG820 PDF预览

ADG820

更新时间: 2024-11-20 22:39:03
品牌 Logo 应用领域
亚德诺 - ADI 复用器开关光电二极管
页数 文件大小 规格书
12页 191K
描述
0.5 OHM CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switches

ADG820 数据手册

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0.5 CMOS  
a
1.8 V to 5.5 V 2:1 Mux/SPDT Switches  
ADG819/ADG820  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
Low On Resistance 0.8 Max at 125C  
0.25 Max On Resistance Flatness  
1.8 V to 5.5 V Single Supply  
200 mA Current Carrying Capability  
Automotive Temperature Range: –40C to +125C  
Rail-to-Rail Operation  
ADG819/  
ADG820  
S2  
D
S1  
IN  
6-Lead SOT-23 Package, 8-Lead SOIC Package, and  
6-Bump MicroCSP (Micro Chip Scale Package) ADG819  
Fast Switching Times  
SWITCHES SHOWN  
FOR A LOGIC “1” INPUT  
Typical Power Consumption (<0.01 W)  
TTL-/CMOS-Compatible Inputs  
Pin Compatible with the ADG719 (ADG819)  
APPLICATIONS  
Power Routing  
Battery-Powered Systems  
Communication Systems  
Data Acquisition Systems  
Cellular Phones  
Modems  
PCMCIA Cards  
Hard Drives  
Relay Replacement  
GENERAL DESCRIPTION  
PRODUCT HIGHLIGHTS  
The ADG819 and the ADG820 are monolithic, CMOS, SPDT  
(single-pole, double-throw) switches. These switches are designed  
on a submicron process that provides low power dissipation yet  
gives high switching speed, low On resistance, and low leakage  
currents.  
1. Very low ON resistance, 0.5 typical  
2. 1.8 V to 5.5 V single-supply operation  
3. High current carrying capability  
4. Tiny 6-lead SOT-23 package, 8-lead µSOIC package,  
and 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP package  
(ADG819 only)  
Low power consumption and an operating supply range of 1.8 V  
to 5.5 V make the ADG819 and ADG820 ideal for battery-pow-  
ered, portable instruments.  
Each switch of the ADG819 and the ADG820 conducts equally  
well in both directions when on. The ADG819 exhibits break-  
before-make switching action, thus preventing momentary shorting  
when switching channels. The ADG820 exhibits make-before-  
break action.  
The ADG819 and the ADG820 are available in a 6-lead SOT-23  
package and an 8-lead µSOIC package. The ADG819 is also  
available in a 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP  
package. This chip occupies only a 1.14 mm × 2.18 mm area,  
making it the ideal candidate for space-constrained applications.  
REV. 0  
Information furnished by Analog Devices is believed to be accurate and  
reliable. However, no responsibility is assumed by Analog Devices for its  
use, norforanyinfringementsofpatentsorotherrightsofthirdpartiesthat  
may result from its use. No license is granted by implication or otherwise  
under any patent or patent rights of Analog Devices.  
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.  
Tel: 781/329-4700  
Fax: 781/326-8703  
www.analog.com  
© Analog Devices, Inc., 2002  

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