ADF4169
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, GND = AGND = DGND = SDGND = CPGND =
0 V, unless otherwise noted.
THERMAL RESISTANCE
Thermal impedance (θJA) is specified for a device with the
exposed pad soldered to AGND.
Table 4.
Parameter
Rating
Table 5. Thermal Resistance
AVDD to GND
DVDD to GND
VP to GND
VP to AVDD
Digital Input/Output Voltage to GND
Analog Input/Output Voltage to GND
REFIN to GND
RFIN to GND
Operating Temperature Range,
Industrial
−0.3 V to +3.9 V
−0.3 V to +2.4 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−40°C to +125°C
Package Type
θJA
Unit
24-Lead LFCSP_WQ
30.4
°C/W
ESD CAUTION
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
−65°C to +125°C
150°C
Peak Temperature
Time at Peak Temperature
ESD
260°C
40 sec
Charged Device Model (CDM)
Human Body Model (HBM)
1000 V
3000 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 6 of 36