ADCMP580/ADCMP581/ADCMP582
APPLICATION INFORMATION
POWER/GROUND LAYOUT AND BYPASSING
GND
The ADCMP58x family of comparators is designed for very
high speed applications. Consequently, high speed design
techniques must be used to achieve the specified performance.
It is critically important to use low impedance supply planes,
particularly for the negative supply (ꢀEE), the output supply
plane (ꢀCCO), and the ground plane (GND). Individual supply
planes are recommended as part of a multilayer board. Provid-
ing the lowest inductance return path for the switching currents
ensures the best possible performance in the target application.
50Ω
50Ω
Q
Q
16mA
It is also important to adequately bypass the input and output
supplies. A 1 μF electrolytic bypass capacitor should be placed
within several inches of each power supply pin to ground. In
addition, multiple high quality 0.1 μF bypass capacitors should
be placed as close as possible to each of the ꢀEE, ꢀCCI, and ꢀCCO
supply pins and should be connected to the GND plane with
redundant vias. High frequency bypass capacitors should be
carefully selected for minimum inductance and ESR. Parasitic
layout inductance should be strictly avoided to maximize the
effectiveness of the bypass at high frequencies.
V
EE
Figure 24. Simplified Schematic Diagram
of the ADCMP580 CML Output Stage
GND / Vcco
ADCMP58x FAMILY OF OUTPUT STAGES
Q
Q
Specified propagation delay dispersion performance is achieved
by using proper transmission line terminations. The outputs of
the ADCMP580 family comparators are designed to directly
drive 400 mꢀ into 50 Ω cable or microstrip/stripline transmis-
sion lines terminated with 50 Ω referenced to the proper return.
The CML output stage is shown in the simplified schematic
diagram in Figure 24. Each output is back-terminated with
50 Ω for best transmission line matching. The outputs of the
ADCMP581/ADCMP582 are illustrated in Figure 25; they
should be terminated to −2 ꢀ for ECL outputs of ADCMP581
and ꢀCCO − 2 ꢀ for PECL outputs of ADCMP582. As an alter-
native, Thevenin equivalent termination networks may also be
used. If these high speed signals must be routed more than a
centimeter, then either microstrip or stripline techniques are
required to ensure proper transition times and to prevent
excessive output ringing and pulse width-dependent
V
EE
Figure 25. Simplified Schematic Diagram of the
ADCMP581/ADCMP582 ECL/PECL Output Stage
USING/DISABLING THE LATCH FEATURE
The latch inputs (LE/ ) are active low for latch mode and are
LE
internally terminated with 50 Ω resistors to the ꢀTT pin. When
using the ADCMP580, ꢀTT should be connected to ground.
When using the ADCMP581, ꢀTT should be connected to
−2 ꢀ. When using the ADCMP582, ꢀTT should be connected
externally to ꢀCCO − 2 ꢀ, preferably with its own low inductance
plane.
propagation delay dispersion.
When using the ADCMP580/ADCMP582, the latch function
can be disabled by connecting the
pin to ꢀEE with an
LE
external pull-down resistor and leaving the LE pin discon-
nected. To prevent excessive power dissipation, the resistor
should be 1.5 kΩ for the ADCMP580 and 1 kΩ for the
ADCMP582. When using the ADCMP581 comparators, the
latch can be disabled by connecting the LE pin to GND with
an external 450 Ω resistor and leaving the
pin disconnected.
LE
The idea is to create an approximate 0.5 ꢀ offset using the
internal resistor as half of the voltage divider. The ꢀTT pin
should be connected as recommended.
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