Datasheet > ADCLK954BCPZ-REEL7

ADCLK954BCPZ-REEL7

更新时间： 2024-01-29 16:55:48

品牌	Logo	应用领域
亚德诺 - ADI		半导体逻辑集成电路驱动时钟
页数	文件大小	规格书
12页	294K
描述
Two Selectable Inputs, 12 LVPECL Outputs, SiGe Clock Fanout Buffer

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ADCLK954

ABSOLUTE MAXIMUM RATINGS

Table 5.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

Parameter

Supply Voltage

V_CC− V_EE

Rating

6.0 V

T_J= T_CASE+ (Ψ_JT× P_D)

Input Voltage

where:

CLK0, CLK1,

, IN_SEL

V_EE− 0.5 V to

V_CC+ 0.5 V

40 mA

CLK0 CLK1

T_Jis the junction temperature (°C).

T_CASEis the case temperature (°C) measured by the customer at

CLK0, CLK1,

to V x Pin (CML,

CLK0 CLK1

the top center of the package.

Ψ_JTis from Table 6.

P_Dis the power dissipation.

LVPECL Termination)

CLK0, CLK1 to

1.8 V

2 V

CLK0 CLK1

Input Termination, V x to CLK0, CLK1,

CLK0

and

CLK1

Values of θ_JAare provided for package comparison and PCB

design considerations. θ_JAcan be used for a first-order approxi-

mation of T_Jby the equation

Maximum Voltage on Output Pins

Maximum Output Current

Voltage Reference (V_REFx)

Operating Temperature Range

Ambient

V_CC+ 0.5 V

35 mA

V_CCto V_EE

T_J= T_A+ (θ_JA× P_D)

where T_Ais the ambient temperature (°C).

−40°C to +85°C

150°C

Values of θ_JBare provided in Table 6 for package comparison

Junction

and PCB design considerations.

Storage Temperature Range

−65°C to +150°C

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value¹

Unit

Junction-to-Ambient Thermal Resistance

Still Air

0.0 m/sec Air Flow

Moving Air

θ_JA

Per JEDEC JESD51-2

Per JEDEC JESD51-6

46.1

°C/W

θ_JMA

1.0 m/sec Air Flow

2.5 m/sec Air Flow

40.3

36.2

°C/W

Junction-to-Board Thermal Resistance

Moving Air

θ_JB

Per JEDEC JESD51-8

1.0 m/sec Air Flow

Junction-to-Case Thermal Resistance

Moving Air

Die-to-Heatsink

Junction-to-Top-of-Package Characterization Parameter

Still Air

28.ꢀ

8.3

°C/W

θ_JC

Per MIL-STD 883, Method 1012.1

Per JEDEC JESD51-2

Ψ_JT

0 m/sec Air Flow

0.6

¹Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the

application to determine if they are similar to those assumed in these calculations.

Rev. A | Page 5 of 12

1 2 3 456 7 8...12

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