AC Electrical Characteristics
The following specifications apply for DV
CC
b
e
e a
; all other limits T
e b
e
§
e
t
f
AV
CC
5.0V, V
5.0V, t
20 ns unless otherwise specified.
e
T 25 C. (Notes 6 and 7)
J
r
e
e
e
Boldface limits apply for T
T
T
MIN
to T
A
J
MAX
A
Typical
(Note 9)
Limit
Units
Symbol
Parameter
Clock Frequency
Conditions
(Notes 10, 19)
(Limit)
f
MHz
CLK
0.5
6.0
MHz(min)
MHz(max)
3.5
Clock Duty Cycle
50
%
40
60
%(min)
%(max)
a
)
CLK
t
t
Conversion Time Using WR
to Start a Conversion
27(1/f
)
)
27(1/f
250 ns
250 ns
(max)
ms(max)
ms(max)
(max)
C
CLK
e
e
‘‘1’’
f
f
3.5 MHz, AZ
7.7
7.95
CLK
e
e
‘‘0’’
1.75 MHz, AZ
15.4
15.65
CLK
e
a
)
CLK
Conversion Time Using S/H
to Start a Conversion
AZ
‘‘1’’
34(1/f
CLK
34(1/f
C
e
e
‘‘1’’
f
3.5 MHz, AZ
9.7
3.5
9.95
3.5
ms(max)
ms(min)
CLK
e
50X
t
t
Acquisition Time (Note 15)
Internal Acquisition Time
R
A
SOURCE
IA
7(1/f
)
7(1/f
)
(max)
CLK
CLK
(When Using WR Control Only)
a
a
250 ns
t
t
t
Auto Zero Time
Acquisition Time
33(1/f
)
33(1/f
)
(max)
ms(max)
ns(max)
ns(max)
(max)
ZA
CLK
CLK
e
f
1.75 MHz
18.8
19.05
350
CLK
Delay from Hold Command
to Falling Edge of EOC
Using WR Control
Using S/H Control
200
100
D(EOC)L
CAL
150
Calibration Time
1399(1/f
399
)
1399 (1/f )
CLK
CLK
e
f
3.5 MHz
400
ms(max)
ns(min)
ns(min)
CLK
t
t
t
Calibration Pulse Width
(Note 16)
60
200
W(CAL)L
W(WR)L
ACC
Minimum WR Pulse Width
60
200
e
e
Maximum Access Time
(Delay from Falling Edge of
RD to Output Data Valid)
C
100 pF
L
50
30
95
70
ns(max)
ns(max)
e
100 pF
t , t
0H 1H
TRI-STATE Control
(Delay from Rising Edge of
RD to Hi-Z State)
R
1 kX, C
L
L
t
t
Maximum Delay from Falling Edge
of RD or WR to Reset of INT
PD(INT)
100
30
175
60
ns(max)
ns(min)
Delay between Successive RD Pulses
RR
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to AGND and DGND, unless otherwise specified.
b
k
l
(AV or DV ), the current at that pin should be limited to
CC CC
Note 3: When the input voltage (V ) at any pin exceeds the power supply rails (V
IN
V
or V
IN
IN
5 mA. The 20 mA maximum package input current rating allows the voltage at any four pins, with an input current limit of 5 mA, to simultaneously exceed the power
supply voltages.
a
Note 4: The power dissipation of this device under normal operation should never exceed 191 mW (Quiescent Power Dissipation
output). Caution should be taken not to exceed absolute maximum power rating when the device is operating in severe fault condition (ex. when any inputs or
outputs exceed the power supply). The maximum power dissipation must be derated at elevated temperatures and is dictated by T (maximum junction
1 TTL Load on each digital
Jmax
temperature), i (package junction to ambient thermal resistance), and T (ambient temperature). The maximum allowable power dissipation at any temperature
JA
A
e
b
e
150 C, and the typical thermal
Jmax
is P
Dmax
(T
T
)/i or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, T
§
Jmax
A
JA
resistance (i ) of the ADC1251 with CMJ, BIJ, and CIJ suffixes when board mounted is 51 C/W.
§
JA
Note 5: Human body model, 100 pF discharged through a 1.5 kX resistor.
4