AD9983A
Preliminary Technical Data
OUTLINE DIMENSIONS
16.20
16.00 SQ
15.80
0.75
0.60
0.45
1.60
MAX
61
60
80
1
PIN 1
14.20
14.00 SQ
13.80
TOP VIEW
(PINS DOWN)
1.45
1.40
1.35
0.20
0.09
7°
3.5°
0°
0.10
COPLANARITY
20
41
40
0.15
0.05
21
SEATING
PLANE
VIEW A
0.65
0.38
0.32
0.22
BSC
LEAD PITCH
VIEW A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-BEC
Figure 20. 80-Lead Low Profile Quad Flat Pack [LQFP]
(ST-80-2)
Dimensions shown in millimeters
0.30
0.25
0.18
PIN 1
9.00
BSC SQ
0.60 MAX
0.60 MAX
64
49
48
INDICATOR
1
PIN 1
INDICATOR
*
4.85
4.70 SQ
4.55
8.75
BSC SQ
TOP
VIEW
EXPOSED PAD
(BOTTOM VIEW)
0.50
33
32
16
17
0.40
0.30
7.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
SEATING
PLANE
0.50 BSC
0.20 REF
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 21. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ST-80-2
ST-80-2
CP-64-1
CP-64-1
AD9983AKSTZ-1401
AD9983AKSTZ-1701
AD9983AKCPZ-1401
AD9983AKCPZ-1701
AD9983A/PCB
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
80-Lead Low Profile Quad Flat Pack [LQFP]
80-Lead Low Profile Quad Flat Pack [LQFP]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Kit
1 Z = Pb-free part.
Rev. PrA | Page 42 of 44