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AD9510BCPZ-REEL7 PDF预览

AD9510BCPZ-REEL7

更新时间: 2024-01-13 01:03:50
品牌 Logo 应用领域
亚德诺 - ADI 时钟
页数 文件大小 规格书
60页 589K
描述
1.2 GHz Clock Distribution IC, PLL Core, Dividers, Delay Adjust, Eight Outputs

AD9510BCPZ-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC64,.35SQ,20针数:64
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.34
系列:9510输入调节:DIFFERENTIAL MUX
JESD-30 代码:S-XQCC-N64JESD-609代码:e3
长度:9 mm逻辑集成电路类型:PLL BASED CLOCK DRIVER
湿度敏感等级:3功能数量:1
反相输出次数:端子数量:64
实输出次数:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC64,.35SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:0.695 ns传播延迟(tpd):1.76 ns
认证状态:Not QualifiedSame Edge Skew-Max(tskwd):1.43 ns
座面最大高度:1 mm子类别:Clock Drivers
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:9 mm
最小 fmax:1200 MHz

AD9510BCPZ-REEL7 数据手册

 浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第4页浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第5页浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第6页浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第8页浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第9页浏览型号AD9510BCPZ-REEL7的Datasheet PDF文件第10页 
AD9510  
TIMING CHARACTERISTICS  
Table 4.  
Parameter  
LVPECL  
Min  
Typ  
Max  
Unit  
Test Conditions/Comments  
Termination = 50 Ω to VS − 2 V  
Output level 3Ch (3Dh) (3Eh) (3Fh)<3:2> = 10b  
20% to 80%, measured differentially  
80% to 20%, measured differentially  
Output Rise Time, tRP  
Output Fall Time, tFP  
PROPAGATION DELAY, tPECL, CLK-TO-LVPECL OUT1  
130  
130  
180  
180  
ps  
ps  
Divide = Bypass  
Divide = 2 − 32  
Variation with Temperature  
OUTPUT SKEW, LVPECL OUTPUTS  
OUT1 to OUT0 on Same Part, tSKP  
OUT2 to OUT3 on Same Part, tSKP  
All LVPECL OUTs on Same Part, tSKP  
All LVPECL OUTs Across Multiple Parts, tSKP_AB  
Same LVPECL OUT Across Multiple Parts, tSKP_AB  
LVDS  
335  
375  
490  
545  
0.5  
635  
695  
ps  
ps  
ps/°C  
2
−5  
15  
90  
+30  
45  
130  
+85  
80  
180  
275  
130  
ps  
ps  
ps  
ps  
ps  
2
2
3
3
Termination = 100 Ω differential  
Output level 40h (41h) (42h) (43h)<2:1> = 01b  
3.5 mA termination current  
Output Rise Time, tRL  
Output Fall Time, tFL  
PROPAGATION DELAY, tLVDS, CLK-TO-LVDS OUT1  
OUT4, OUT5, OUT6, OUT7  
Divide = Bypass  
Divide = 2 − 32  
Variation with Temperature  
OUTPUT SKEW, LVDS OUTPUTS  
OUT4 to OUT7 on Same Part, tSKV  
OUT5 to OUT6 on Same Part, tSKV  
200  
210  
350  
350  
ps  
ps  
20% to 80%, measured differentially  
80% to 20%, measured differentially  
Delay off on OUT5 and OUT6  
0.99  
1.04  
1.33  
1.38  
0.9  
1.59  
1.64  
ns  
ns  
ps/°C  
Delay off on OUT5 and OUT6  
2
−85  
−175  
−175  
+270 ps  
+155 ps  
+270 ps  
450  
325  
2
2
All LVDS OUTs on Same Part, tSKV  
All LVDS OUTs Across Multiple Parts, tSKV_AB  
Same LVDS OUT Across Multiple Parts, tSKV_AB  
3
ps  
ps  
3
CMOS  
Output Rise Time, tRC  
Output Fall Time, tFC  
B outputs are inverted; termination = open  
20% to 80%; CLOAD = 3 pF  
80% to 20%; CLOAD = 3 pF  
681  
646  
865  
992  
ps  
ps  
PROPAGATION DELAY, tCMOS, CLK-TO-CMOS OUT1  
Delay off on OUT5 and OUT6  
Divide = Bypass  
Divide = 2 − 32  
Variation with Temperature  
OUTPUT SKEW, CMOS OUTPUTS  
All CMOS OUTs on Same Part, tSKC  
1.02  
1.07  
1.39  
1.44  
1
1.71  
1.76  
ns  
ns  
ps/°C  
Delay off on OUT5 and OUT6  
2
−140 +145  
+300 ps  
650  
500  
3
All CMOS OUTs Across Multiple Parts, tSKC_AB  
Same CMOS OUT Across Multiple Parts, tSKC_AB  
ps  
ps  
3
LVPECL-TO-LVDS OUT  
Output Skew, tSKP_V  
LVPECL-TO-CMOS OUT  
Output Skew, tSKP_C  
LVDS-TO-CMOS OUT  
Output Skew, tSKV_C  
Everything the same; different logic type  
LVPECL to LVDS on same part  
0.74  
0.88  
158  
0.92  
1.14  
353  
1.14  
1.43  
506  
ns  
ns  
ps  
Everything the same; different logic type  
LVPECL to CMOS on same part  
Everything the same; different logic type  
LVDS to CMOS on same part  
Rev. A | Page 7 of 60  
 

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