AD8383
ABSOLUTE MAXIMUM RATINGS
Table 2. AD8383 Stress Ratings
Parameter
MAXIMUM POWER DISSIPATION
Junction Temperature
Rating
Supply Voltages
The maximum power that can be safely dissipated by the
AD8383 is limited by its junction temperature. The maximum
safe junction temperature for plastic encapsulated devices as
determined by the glass transition temperature of the plastic is
approximately 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
AVCCx – AGNDx
DVCC – DGND
Input Voltages
18 V
4.5 V
Maximum Digital Input Voltages
Minimum Digital Input Voltages
Maximum Analog Input Voltages
Minimum Analog Input Voltages
Internal Power Dissipation8
LFCSP Package @ 25°C Ambient
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
DVCC + 0.5 V
DGND – 0.5 V
AVCC + 0.5 V
AGND – 0.5 V
3.8 W
Overload Protection
0°C to 85°C
–65°C to +125°C
300°C
The AD8383 employs a 2-stage overload protection circuit that
consists of an output current limiter and a thermal shutdown.
The maximum current at any one output of the AD8383 is
internally limited to 100 mA, average. In the event of a momen-
tary short-circuit between a video output and a power supply
rail (AVCC or AGND), the output current limit is sufficiently
low to provide temporary protection.
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to the
absolute maximum ratings for extended periods may reduce
device reliability.
The thermal shutdown debiases the output amplifier when the
junction temperature reaches the internally set trip point. In the
event of an extended short-circuit between a video output and a
power supply rail, the output amplifier current continues to
switch between 0 mA and 100 mA typical with a period
determined by the thermal time constant and the hysteresis of
the thermal trip point. The thermal shutdown provides long-
term protection by limiting the average junction temperature to
a safe level.
8 48-Lead LFCSP Package:
θJA = 26°C/W (Still Air): JEDEC STD, 4-layer board with 0 CFM airflow
θJC = 20°C/W
ψJB = 11.0°C/W in Still Air
Operating Temperature Range
Production testing guarantees a minimum thermal shutdown
junction temperature (TJ) of at least 125°C.
To ensure operation at TJ < 125°C, it is necessary to limit the
maximum power dissipation as described in the Applications
section.
Exposed Paddle
The die paddle must be soldered to AVCC for reliable electrical
operation.
See the Applications section for details regarding use of the
exposed paddles to dissipate excess heat.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
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