Datasheet > AD6426XST

AD6426XST

更新时间： 2024-11-28 22:47:31

品牌	Logo	应用领域
亚德诺 - ADI		GSM
页数	文件大小	规格书
50页	442K
描述
Enhanced GSM Processor

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

AD6426XST 数据手册

Enhanced GSM Processor

Preliminary Technical Information

FEATURES

AD6426

VOICEBAND /

BASEBAND

CODEC

UNIVERSAL

Complete Single Chip GSM Processor

SYSTEM CONN.

INTERFACE

CHANNEL

CODEC

Channel Codec Subsystem including

Channel Coder/Decoder

INTERFACE

Interleaver/De-interleaver

Encryption/Decryption

TEST

INTERFACE

DSP

DISPLAY

INTERFACE

Control Processor Subsystem including

CHANNEL

EQUALIZER

16-bit Control Processor (H8/300H)

Parallel and Serial Display Interface

SIM

INTERFACE

RADIO

INTERFACE

Keypad Interface

EEPROM Interface

SPEECH

CODEC

EEPROM

ACCESSORY

INTERFACE

SIM-Interface

INTERFACE

Universal System Connector Interface

Interface to AD6425

Control of Radio Subsystem

Programmable backlight duty cycle

Real Time Clock with Alarm

CONTROL

PROCESSOR

KEYPAD /

BACKLIGHT

INTERFACE

MEMORY

INTERFACE

Battery ID Chip Interface

DSP Subsystem including

Figure 1. Functional Block Diagram

16-bit DSP with ROM coded firmware for

Full rate Speech Encoding/Decoding (GSM 06.10)

Enhanced Full Rate Speech

In addition, the EGSMP supports both A5/1 and A5/2

encryption algorithms as well as operation in non-encrypted

mode.

Encoding/Decoding (GSM 06.60)

Equalization with 16-state Viterbi (Soft Decision)

DTMF and Call Progress Tone Generation

Power Management of Mobile Radio

Slow Clocking scheme for low Idle Mode current

Ultra Low Power Design

On-chip GSM Data Services up to 14.4 kbit/s

JTAG Test Interface

2.4V to 3.3V Operating Voltage

144-Lead LQFP and 144-Lead PBGA packages

The EGSMP integrates a high performance 16-bit

microprocessor (Hitachi H8/300H), that supports all the GSM

terminal software, including Layer 1, 2 and 3 of the GSM

protocol stack, the MMI and applications software such as

data services, test and maintenance.

The use of the standard H8 processor allows the use of HIOS,

the Hitachi real time kernel, as well as a full range of software

development tools including C compilers, debuggers and in-

circuit emulators. The EGSMP also integrates a high

performance 16-bit Digital Signal Processor (DSP), which

provides speech transcoding and supports all audio functions

in both transmit and receive. In receive it equalizes the

received signal using a 16-state (Viterbi) soft decision

equalizer.

APPLICATIONS

GSM 900 / DCS1800 / PCS1900 Mobile Stations (MS)

Compliant to Phase 1 and Phase 2 specifications

GENERAL DESCRIPTION

The EGSMP interfaces with all the peripheral sub-systems of

the terminal, including the keypad, memories, display driver,

SIM, DTE and DTA data services interface and radio. It also

has a general purpose interface that can be used to support an

external connection to a car kit or battery charger.

The AD6426 Enhanced GSM Processor (EGSMP) is the

central component of the highly integrated AD20msp425 GSM

Chipset. Offering a low total chip count, low bill of materials

cost and long talk and standby times, the chipset offers

designers a straightforward route to a highly competitive

product in the GSM/DCS1800 market.

The EGSMP interfaces with the AD6425 or the AD6421

Voiceband/Baseband Codec through a dedicated serial port.

The EGSMP performs all the baseband functions of the Layer

1 processing of the GSM air interface. This includes all data

encoding and decoding processes as well as timing and radio

sub-system control functions.

ORDERING GUIDE

Model

Temperature Range

Package

AD6426XST

AD6426XB

-25°C to +85°C

144-Lead LQFP

144-Lead PBGA

The EGSMP supports full rate and enhanced full rate speech

traffic as well as a full range of data services including F14.4.

This Information applies to a product under development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no

obligation regarding future manufacture unless otherwise agreed to in writing. No responsibility is assumed by Analog Devices for its use; nor for any

infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent

rights of Analog Devices.

Revision Preliminary 2.3 (June 9, ´98)

- 1 -

Confidential Information

12 3 4 5 6 7...50

中文翻译

下载PDF

与AD6426XST相关器件

型号	品牌	获取价格	描述	数据表
AD642J	ADI	获取价格	Precision, Low Cost Dual BiFET Op Amp
AD642JCHIPS	ADI	获取价格	IC DUAL OP-AMP, 3500 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC, DIE, Operational Amplifier
AD642JH	ROCHESTER	获取价格	DUAL OP-AMP, 3500 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, HERMETIC SEALED, METAL CAN, TO-9
AD642JH	ADI	获取价格	IC DUAL OP-AMP, 3500 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, HERMETIC SEALED, METAL CAN, T
AD642JH/+	ADI	获取价格	IC IC,OP-AMP,DUAL,BIPOLAR/JFET,CAN,8PIN,METAL, Operational Amplifier
AD642K	ADI	获取价格	Precision, Low Cost Dual BiFET Op Amp
AD642KCHIPS	ADI	获取价格	IC DUAL OP-AMP, 1000 uV OFFSET-MAX, 1 MHz BAND WIDTH, UUC8, DIE-8, Operational Amplifier
AD642KH	ROCHESTER	获取价格	DUAL OP-AMP, 2000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, HERMETIC SEALED, METAL CAN, TO-9
AD642KH/+	ADI	获取价格	IC IC,OP-AMP,DUAL,BIPOLAR/JFET,CAN,8PIN,METAL, Operational Amplifier
AD642L	ADI	获取价格	Precision, Low Cost Dual BiFET Op Amp

与AD6426XST相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

51
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

41
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

69
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

65

产品中心

服务支持

精选活动

关于我们

帮助中心

AD6426XST

AD6426XST 数据手册

与AD6426XST相关器件

与AD6426XST相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

AD6426XST

AD6426XST 数据手册

与AD6426XST相关器件

与AD6426XST相关文章

您还可以找

您在本页遇到什么问题？