AD5323

更新时间： 2024-01-28 12:14:19

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
18页	227K
描述
+2.5 V to +5.5 V, 230 uA, Dual Rail-to-Rail Voltage Output 8-/10-/12-Bit DACs

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AD5323 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	TSSOP
包装说明：	TSSOP, TSSOP16,.25	针数：	16
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.28
Is Samacsys：	N	最大模拟输出电压：	5.499 V
最小模拟输出电压：	0.001 V	转换器类型：	D/A CONVERTER
输入位码：	BINARY	输入格式：	SERIAL
JESD-30 代码：	R-PDSO-G16	JESD-609代码：	e3
长度：	5 mm	最大线性误差 (EL)：	0.1953%
湿度敏感等级：	1	位数：	12
功能数量：	1	端子数量：	16
最高工作温度：	105 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装等效代码：	TSSOP16,.25	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	260
电源：	2.5/5.5 V	认证状态：	Not Qualified
座面最大高度：	1.2 mm	标称安定时间 (tstl)：	8 µs
子类别：	Other Converters	最大压摆率：	0.4 mA
标称供电电压：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Matte Tin (Sn)	端子形式：	GULL WING
端子节距：	0.65 mm	端子位置：	DUAL
处于峰值回流温度下的最长时间：	30	宽度：	4.4 mm
Base Number Matches：	1

AD5323 数据手册

AD5303/AD5313/AD5323

SCLK

SYNC

DIN

DB15

DB0

DB15

DB0

INPUT WORD FOR DAC N

UNDEFINED

INPUT WORD FOR DAC (N+1)

INPUT WORD FOR DAC N

SDO

SCLK

SDO

Figure 45. Daisy-Chaining Timing Diagram

Power Supply Bypassing and Grounding

The power supply lines of the AD5303/AD5313/AD5323 should

use as large a trace as possible to provide low impedance paths

and reduce the effects of glitches on the power supply line. Fast

switching signals such as clocks should be shielded with digital

ground to avoid radiating noise to other parts of the board, and

should never be run near the reference inputs. Avoid crossover

of digital and analog signals. Traces on opposite sides of the

board should run at right angles to each other. This reduces the

effects of feedthrough through the board. A microstrip tech-

nique is by far the best, but not always possible with a double-

sided board. In this technique, the component side of the board

is dedicated to ground plane while signal traces are placed on

the solder side.

In any circuit where accuracy is important, careful consideration

of the power supply and ground return layout helps to ensure

the rated performance. The printed circuit board on which the

AD5303/AD5313/AD5323 is mounted should be designed so

that the analog and digital sections are separated, and confined

to certain areas of the board. If the AD5303/AD5313/AD5323

is in a system where multiple devices require an AGND to

DGND connection, the connection should be made at one

point only. The star ground point should be established as close

as possible to the AD5303/AD5313/AD5323. The AD5303/

AD5313/AD5323 should have ample supply bypassing of 10 µF

in parallel with 0.1 µF on the supply located as close to the

package as possible, ideally right up against the device. The

10 µF capacitors are the tantalum bead type. The 0.1 µF

capacitor should have low Effective Series Resistance (ESR)

and Effective Series Inductance (ESI), like the common

ceramic types that provide a low impedance path to ground at

high frequencies to handle transient currents due to internal

logic switching.

REV. 0

–17–

1...14 15 161718

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与AD5323相关器件

型号	品牌	描述	获取价格	数据表
AD5323*	ADI	+2.5 V to +5.5 V. 230 uA. Dual Rail-to-Rail Voltage Output 8-/10-/12-Bit DACs	获取价格
AD5323ARU	ADI	2.5 V to 5.5 V, 230 Î¼A, Dual Rail-to-Rail Vo	获取价格
AD5323ARU	ROCHESTER	SERIAL INPUT LOADING, 8 us SETTLING TIME, 12-BIT DAC, PDSO16, MO-153AB, TSSOP-16	获取价格
AD5323ARU-REEL7	ADI	2.5 V to 5.5 V, 230 Î¼A, Dual Rail-to-Rail Vo	获取价格
AD5323ARU-REEL7	ROCHESTER	SERIAL INPUT LOADING, 8 us SETTLING TIME, 12-BIT DAC, PDSO16, MO-153AB, TSSOP-16	获取价格
AD5323ARUZ	ADI	2.5 V to 5.5 V, 230 µA, Dual Rail-to-Rail Voltage Output 12-Bit DAC	获取价格

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