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AAT3686 PDF预览

AAT3686

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
ANALOGICTECH 电池
页数 文件大小 规格书
24页 481K
描述
USB Port/AC Adapter Lithium-Ion/Polymer Battery Charger

AAT3686 数据手册

 浏览型号AAT3686的Datasheet PDF文件第16页浏览型号AAT3686的Datasheet PDF文件第17页浏览型号AAT3686的Datasheet PDF文件第18页浏览型号AAT3686的Datasheet PDF文件第20页浏览型号AAT3686的Datasheet PDF文件第21页浏览型号AAT3686的Datasheet PDF文件第22页 
AAT3686  
USB Port/AC Adapter  
Lithium-Ion/Polymer Battery Charger  
Timing Diagram  
SQPULSE  
PDATA  
SQ  
System Reset  
System Start  
CK  
TSYNC  
TLAT  
TOFF  
Data  
TDATA(RPT) = TSYNC + TLAT < 2.5 PDATA  
TOFF > 2 PDATA  
N=3  
N=1  
N=2  
VBAT = Battery voltage as seen at the BAT pin  
Thermal Considerations  
The AAT3686 is offered in a 4x4mm TDFN pack-  
age which can provide up to 2.7W of power dissi-  
pation when it is properly bonded to a printed cir-  
cuit board and has a maximum thermal resistance  
of 37°C/W. Many considerations should be taken  
into account when designing the printed circuit  
board layout, as well as the placement of the  
charger IC package in proximity to other heat gen-  
erating devices in a given application design. The  
ambient temperature around the charger IC will  
also have an effect on the thermal limits of a bat-  
tery charging application. The maximum limits that  
can be expected for a given ambient condition can  
be estimated by the following discussion:  
ICC = Maximum constant fast charge current pro-  
grammed for the application  
IOP = Quiescent current consumed by the charg-  
er IC for normal operation  
Next, the maximum operating ambient temperature  
for a given application can be estimated based on  
the thermal resistance of the 4x4mm TDFN pack-  
age when sufficiently mounted to a PCB layout and  
the internal thermal loop temperature threshold.  
Eq. 2:  
TA = TJ - (θJA · PD)  
First, the maximum power dissipation for a given  
situation should be calculated:  
Where:  
TA  
TJ  
= Ambient temperature in degrees C  
Eq. 1:  
PD = [(VIN - VBAT) · ICC + (VIN · IOP)]  
= Maximum device junction temperature  
below the thermal loop threshold  
PD = Total power dissipation by the device  
Where:  
θJA = Package thermal resistance in °C/W  
PD = Total power dissipation by the device  
VIN = Either VADP or VUSB, depending on which  
mode is selected  
3686.2006.06.1.5  
19  

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