A82DL1624UG-70I

更新时间： 2024-01-27 00:18:15

品牌	Logo	应用领域
联笙电子 - AMICC		闪存静态存储器
页数	文件大小	规格书
57页	896K
描述
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S

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中文翻译

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技术参数
数据手册

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A82DL1624UG-70I 技术参数

生命周期：	Contact Manufacturer	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.69
Base Number Matches：	1

A82DL1624UG-70I 数据手册

A82DL16x4T(U) Series

Package Information

69LD STF BGA (8 x 11mm) Outline Dimensions

unit: mm

D¹

-A-

aaa

Pin #1

-B-

aaa

1 2 3 4 5 6 7 8 9 10

See Detail B

ddd

eee C A B

See Detail A

CAVITY

// bbb C

-C-

ccc C

SOLDER BALL

SEATING PLANE

Detail A

Detail B

Dimensions in mm

Dimensions in inches

Symbol

Min

Nom

Max

Min

Nom

Max

0.055

0.014

0.040

0.012

0.319

0.437

0.25

0.91

0.22

7.90

10.90

1.40

0.35

1.01

0.30

8.10

11.10

0.30

0.96

0.26

8.00

11.00

7.20

0.80

0.40

0.15

0.20

0.12

0.15

0.08

10/10

0.010

0.036

0.009

0.311

0.429

0.012

0.038

0.010

0.315

0.433

0.283

0.031

0.16

0.35

0.45

0.14

0.18

aaa

bbb

ccc

ddd

eee

MD/ME

0.006

0.008

0.005

0.006

0.003

10/10

Notes:

1. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BALLS.

2. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL

DIAMETER, PARALLEL TO PRIMARY DATUM C.

3. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN

THE EDGE OF THE SOLDER BALL AND THE BODY EDGE.

4. REFERENCE DOCUMENT : JEDEC MO-219

5. THE PATTERN OF PIN 1 FIDUCIAL IS FOR REFERENCE ONLY.

PRELIMINARY (August, 2005, Version 0.0)

AMIC Technology, Corp.

1...54 55 5657

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与A82DL1624UG-70I相关器件

型号	品牌	获取价格	描述	数据表
A82DL1624UG-70IF	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1624UG-70U	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1624UG-70UF	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit
A82DL1632	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70F	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70I	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70IF	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70U	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit
A82DL1632TG-70UF	AMICC	获取价格	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit

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