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A8285

更新时间: 2024-02-20 17:55:37
品牌 Logo 应用领域
急速微 - ALLEGRO 稳压器
页数 文件大小 规格书
17页 526K
描述
LNB Supply and Control Voltage Regulator

A8285 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:BATWING, LEAD FREE, PLASTIC, SOIC-16针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.81模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G16JESD-609代码:e3
长度:10.21 mm湿度敏感等级:3
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP16,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
电源:10/16 V认证状态:Not Qualified
座面最大高度:2.64 mm子类别:Power Management Circuits
最大供电电流 (Isup):7 mA最大供电电压 (Vsup):16 V
最小供电电压 (Vsup):10 V标称供电电压 (Vsup):12 V
表面贴装:YES温度等级:OTHER
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.49 mm
Base Number Matches:1

A8285 数据手册

 浏览型号A8285的Datasheet PDF文件第8页浏览型号A8285的Datasheet PDF文件第9页浏览型号A8285的Datasheet PDF文件第10页浏览型号A8285的Datasheet PDF文件第12页浏览型号A8285的Datasheet PDF文件第13页浏览型号A8285的Datasheet PDF文件第14页 
A8285/A8287  
LNB Supply and Control Voltage Regulator  
Power Dissipation  
ture and it rises by 2.7 m/ºC with respect to the specied  
gure, RDSBOOST(25ºC), when Tj equals 25ºC.  
To ensure that the device operates within the safe operating  
temperature range, several checks should be performed. An  
approximate operating junction temperature can be deter-  
mined by estimating the power losses and the thermal imped-  
ance characteristics of the printed circuit board solution. To  
do so, perform the following procedure:  
Actual RDSBOOST = RDSBOOST(25ºC) + [(T – 25) 2.7 m]  
×
j
(d) Determine losses in each block PTOT; based on the relative  
value of VIN, perform either (i) or (ii):  
1. Estimate the maximum ambient temperature (TA).  
(i) When VIN < VOUT + VD + VREG. Note that worst case dis-  
sipation occurs at minimum input voltage.  
2. Dene the maximum running junction temperature (TJ)of  
A8285/A8287. Note that the absolute maximum junction  
temperature should never exceed 150ºC.  
PTOT = Pd_Rds + Pd_sw + Pd_control + Pd_lin  
where  
3. Determine worst case power dissipation:  
(a) Estimate the duty cycle D:  
Pd_Rds = I2PK  
R
D
×
×
DSBOOST  
D = 1 – [VIN / (VOUT + VD + VREG)]  
Pd_control = 15 mA  
V
×
IN  
where:  
Pd_lin = VREG  
I
×
LOAD  
VD is the voltage drop of the boost diode, and  
VREG can be taken from the specication table.  
(b) Estimate the peak current in boost stage IPK:  
and Pd_sw (switching losses estimate); worst case = 70 mW.  
(ii) When VIN > VOUT + VD + VREG. Note that worst case  
dissipation in this case occurs at maximum input voltage.  
IPK = VOUT [ I  
/ (0.89 V )]  
IN  
×
×
LOAD  
PTOT = Pd_control + Pd_lin  
where:  
Pd_control = 15 mA  
V
IN  
×
(c) Estimate boost RDS (RDSBOOST ) at maximum running junc-  
tion temperature. RDSBOOST is a function of junction tempera-  
Pd_lin = (VIN – VD – VOUT  
)
I
LOAD  
×
Step 4. Determine the thermal impedance required in the  
solution:  
Status (I2C Read) Register Table  
RØJA = (TJ – TA) / PTOT  
Bit  
0
Name  
TSD  
Function  
Thermal Shutdown  
The RØJA for one or two layer PCBs can be estimated from  
the RØJA vs. Area charts on the following page.  
1
OCP  
Overcurrent  
Reserved  
2
3
Reserved  
Note: For maximum effectiveness, the PCB area underneath  
the IC should be lled copper and connected to pins 4 and  
13 for A8285, and pins 6, 7, 18, and 19 for A8287. Where  
a PCB with two or more layers is used, apply thermal vias,  
placing them adjacent to each of the above pins, and under-  
neath the IC.  
4
PNG  
DIS  
Power Not Good  
LNB output disabled  
Reserved  
5
6
7
VUV  
VIN Undervoltage  
11  
www.allegromicro.com  
115 Northeast Cutoff, Box 15036  
Worcester, Massachusetts 01615-0036 (508) 853-5000  

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