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A42MX36-3BGG272 PDF预览

A42MX36-3BGG272

更新时间: 2024-11-01 04:12:35
品牌 Logo 应用领域
美高森美 - MICROSEMI 时钟可编程逻辑
页数 文件大小 规格书
124页 3142K
描述
Field Programmable Gate Array, 1184 CLBs, 54000 Gates, 100MHz, 2438-Cell, CMOS, PBGA272, PLASTIC, BGA-272

A42MX36-3BGG272 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:BGA,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.81
其他特性:ALSO OPERATES AT 5V SUPPLY最大时钟频率:100 MHz
CLB-Max的组合延迟:1.9 nsJESD-30 代码:S-PBGA-B272
JESD-609代码:e1长度:27 mm
湿度敏感等级:3可配置逻辑块数量:2438
等效关口数量:54000端子数量:272
最高工作温度:70 °C最低工作温度:
组织:2438 CLBS, 54000 GATES封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):250
可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY认证状态:Not Qualified
座面最大高度:2.5 mm最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:27 mmBase Number Matches:1

A42MX36-3BGG272 数据手册

 浏览型号A42MX36-3BGG272的Datasheet PDF文件第2页浏览型号A42MX36-3BGG272的Datasheet PDF文件第3页浏览型号A42MX36-3BGG272的Datasheet PDF文件第4页浏览型号A42MX36-3BGG272的Datasheet PDF文件第5页浏览型号A42MX36-3BGG272的Datasheet PDF文件第6页浏览型号A42MX36-3BGG272的Datasheet PDF文件第7页 
v6.1  
40MX and 42MX FPGA Families  
Features  
HiRel Features  
Commercial, Industrial, Automotive, and Military  
Temperature Plastic Packages  
High Capacity  
Commercial, Military Temperature, and MIL-STD-883  
Ceramic Packages  
Single-Chip ASIC Alternative  
3,000 to 54,000 System Gates  
Up to 2.5 kbits Configurable Dual-Port SRAM  
Fast Wide-Decode Circuitry  
Up to 202 User-Programmable I/O Pins  
QML Certification  
Ceramic Devices Available to DSCC SMD  
Ease of Integration  
Mixed-Voltage Operation (5.0V or 3.3V for core and  
I/Os), with PCI-Compliant I/Os  
High Performance  
Up to 100% Resource Utilization and 100% Pin  
Locking  
5.6 ns Clock-to-Out  
250 MHz Performance  
5 ns Dual-Port SRAM Access  
100 MHz FIFOs  
Deterministic, User-Controllable Timing  
Unique In-System Diagnostic and Verification  
Capability with Silicon Explorer II  
7.5 ns 35-Bit Address Decode  
Low Power Consumption  
IEEE Standard 1149.1 (JTAG) Boundary Scan Testing  
Product Profile  
Device  
A40MX02  
A40MX04  
A42MX09  
A42MX16  
A42MX24  
A42MX36  
Capacity  
System Gates  
SRAM Bits  
3,000  
6,000  
14,000  
24,000  
36,000  
54,000  
2,560  
Logic Modules  
Sequential  
Combinatorial  
Decode  
295  
547  
348  
336  
624  
608  
954  
912  
24  
1,230  
1,184  
24  
Clock-to-Out  
9.5 ns  
9.5 ns  
5.6 ns  
6.1 ns  
6.1 ns  
6.3 ns  
SRAM Modules  
(64x4 or 32x8)  
348  
516  
2
624  
928  
2
954  
1,410  
2
10  
1,230  
1,822  
6
Dedicated Flip-Flops  
Maximum Flip-Flops  
Clocks  
147  
1
273  
1
User I/O (maximum)  
PCI  
57  
69  
104  
140  
176  
Yes  
Yes  
202  
Yes  
Boundary Scan Test (BST)  
Yes  
Packages (by pin count)  
PLCC  
PQFP  
VQFP  
TQFP  
CQFP  
PBGA  
44, 68  
44, 68, 84  
84  
100, 160  
100  
176  
84  
84  
160, 208  
100  
80  
100  
80  
100, 160, 208  
208, 240  
100  
176  
176  
208, 256  
272  
April 2009  
i
© 2009 Actel Corporation  
See the Actel website for the latest version of the datasheet.  

A42MX36-3BGG272 替代型号

型号 品牌 替代类型 描述 数据表
A42MX36-BG272 MICROSEMI

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Field Programmable Gate Array, 2438 CLBs, 54000 Gates, 73MHz, CMOS, PBGA272, PLASTIC, BGA-

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