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A42MX09-2VQ100I PDF预览

A42MX09-2VQ100I

更新时间: 2024-10-28 12:41:27
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列可编程逻辑时钟
页数 文件大小 规格书
142页 7439K
描述
40MX and 42MX FPGA Families

A42MX09-2VQ100I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:TFQFP,
针数:100Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.71
Is Samacsys:N其他特性:ALSO OPERATES AT 5V SUPPLY
最大时钟频率:146 MHzCLB-Max的组合延迟:1.8 ns
JESD-30 代码:S-PQFP-G100JESD-609代码:e0
长度:14 mm湿度敏感等级:3
可配置逻辑块数量:684等效关口数量:14000
端子数量:100最高工作温度:85 °C
最低工作温度:-40 °C组织:684 CLBS, 14000 GATES
封装主体材料:PLASTIC/EPOXY封装代码:TFQFP
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):240可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

A42MX09-2VQ100I 数据手册

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Revision 11  
40MX and 42MX FPGA Families  
HiRel Features  
Features  
High Capacity  
Commercial, Industrial, Automotive, and Military  
Temperature Plastic Packages  
Single-Chip ASIC Alternative  
Commercial, Military Temperature, and MIL-STD-883  
Ceramic Packages  
3,000 to 54,000 System Gates  
Up to 2.5 kbits Configurable Dual-Port SRAM  
Fast Wide-Decode Circuitry  
QML Certification  
Ceramic Devices Available to DSCC SMD  
Up to 202 User-Programmable I/O Pins  
Ease of Integration  
Mixed-Voltage Operation (5.0V or 3.3V for core and  
I/Os), with PCI-Compliant I/Os  
High Performance  
5.6 ns Clock-to-Out  
Up to 100% Resource Utilization and 100% Pin Locking  
Deterministic, User-Controllable Timing  
250 MHz Performance  
5 ns Dual-Port SRAM Access  
100 MHz FIFOs  
Unique In-System Diagnostic and Verification Capability  
with Silicon Explorer II  
7.5 ns 35-Bit Address Decode  
Low Power Consumption  
IEEE Standard 1149.1 (JTAG) Boundary Scan Testing  
Product Profile  
Device  
A40MX02  
A40MX04  
A42MX09  
A42MX16  
A42MX24  
A42MX36  
Capacity  
System Gates  
SRAM Bits  
3,000  
6,000  
14,000  
24,000  
36,000  
54,000  
2,560  
Logic Modules  
Sequential  
Combinatorial  
Decode  
295  
547  
348  
336  
624  
608  
954  
912  
24  
1,230  
1,184  
24  
Clock-to-Out  
9.5 ns  
9.5 ns  
5.6 ns  
6.1 ns  
6.1 ns  
6.3 ns  
SRAM Modules  
(64x4 or 32x8)  
348  
516  
2
624  
928  
2
954  
1,410  
2
10  
1,230  
1,822  
6
Dedicated Flip-Flops  
Maximum Flip-Flops  
Clocks  
147  
1
273  
1
User I/O (maximum)  
PCI  
57  
69  
104  
140  
176  
Yes  
Yes  
202  
Yes  
Yes  
Boundary Scan Test (BST)  
Packages (by pin count)  
PLCC  
PQFP  
VQFP  
TQFP  
CQFP  
PBGA  
44, 68  
44, 68, 84  
84  
100, 160  
100  
176  
84  
84  
160, 208  
208, 240  
100  
80  
100  
80  
100, 160, 208  
100  
176  
176  
208, 256  
272  
May 2012  
i
© 2012 Microsemi Corporation  

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