Revision 10
ProASIC3E Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
Pro (Professional) I/O
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700 Mbps DDR, LVDS-Capable I/Os
High Capacity
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 8 Banks per Chip
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
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600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 620 User I/Os
Reprogrammable Flash Technology
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Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
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130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
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Live at Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
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I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
On-Chip User Nonvolatile Memory
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1 kbit of FlashROM with Synchronous Interfacing
High Performance
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350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC 3E Family
In-System Programming (ISP) and Security
®
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ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
Clock Conditioning Circuit (CCC) and PLL
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FlashLock Designed to Secure FPGA Contents
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Six CCC Blocks, Each with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
Low Power
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Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
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Wide Input Frequency Range (1.5 MHz to 200 MHz)
SRAMs and FIFOs
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Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
High-Performance Routing Hierarchy
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Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
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True Dual-Port SRAM (except ×18)
24 SRAM and FIFO Configurations with Synchronous Operation
up to 350 MHz
ARM® Processor Support in ProASIC3E FPGAs
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M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available
with or without Debug
Table 1-1 • ProASIC3E Product Family
ProASIC3E Devices
A3PE600
A3PE1500
A3PE3000
1
Cortex-M1 Devices
M1A3PE1500
M1A3PE3000
System Gates
600,000
13,824
108
24
1,500,000
3,000,000
VersaTiles (D-flip-flops)
RAM Kbits (1,024 bits)
4,608-Bit Blocks
38,400
270
60
75,264
504
112
1
FlashROM Kbits
1
1
Secure (AES) ISP
Yes
6
Yes
6
Yes
6
2
CCCs with Integrated PLLs
3
VersaNet Globals
18
18
18
I/O Banks
8
8
8
Maximum User I/Os
270
444
620
Package Pins
PQFP
FBGA
PQ208
FG256, FG484
PQ208
FG484, FG676
PQ208
FG324, FG484, FG896
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. The PQ208 package supports six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.
March 2012
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© 2012 Microsemi Corporation