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A3PE600-1FG256I

更新时间： 2024-11-10 20:57:03
品牌 Logo 应用领域
美高森美 - MICROSEMI 栅可编程逻辑
页数 文件大小 规格书
166页 8664K
描述
Field Programmable Gate Array, 13824 CLBs, 600000 Gates, CMOS, PBGA256, 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

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A3PE600-1FG256I 技术参数

是否Rohs认证： 不符合生命周期：Active
包装说明：BGA,Reach Compliance Code：unknown
HTS代码：8542.39.00.01风险等级：5.3
JESD-30 代码：S-PBGA-B256JESD-609代码：e0
长度：17 mm湿度敏感等级：3
可配置逻辑块数量：13824等效关口数量：600000
端子数量：256最高工作温度：85 °C
最低工作温度：-40 °C组织：13824 CLBS, 600000 GATES
封装主体材料：PLASTIC/EPOXY封装代码：BGA
封装形状：SQUARE封装形式：GRID ARRAY
峰值回流温度（摄氏度）：225可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY
认证状态：Not Qualified座面最大高度：1.8 mm
最大供电电压：1.575 V最小供电电压：1.425 V
标称供电电压：1.5 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：TIN LEAD/TIN LEAD SILVER端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：30宽度：17 mm
Base Number Matches：1

A3PE600-1FG256I 数据手册

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Revision 14  
ProASIC3E Flash Family FPGAs  
with Optional Soft ARM Support  
Features and Benefits  
Pro (Professional) I/O  
•
•
•
•
700 Mbps DDR, LVDS-Capable I/Os  
High Capacity  
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Bank-Selectable I/O Voltages—up to 8 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS  
2.5 V / 5.0 V Input  
•
•
•
600 k to 3 Million System Gates  
108 to 504 kbits of True Dual-Port SRAM  
Up to 620 User I/Os  
Reprogrammable Flash Technology  
•
•
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and  
M-LVDS  
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL  
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3  
Class I and II  
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS  
Process  
•
•
•
Instant On Level 0 Support  
Single-Chip Solution  
Retains Programmed Design when Powered Off  
•
•
•
•
•
•
•
•
I/O Registers on Input, Output, and Enable Paths  
Hot-Swappable and Cold Sparing I/Os  
Programmable Output Slew Rate and Drive Strength  
Programmable Input Delay  
Schmitt Trigger Option on Single-Ended Inputs  
Weak Pull-Up/-Down  
On-Chip User Nonvolatile Memory  
•
1 kbit of FlashROM with Synchronous Interfacing  
High Performance  
•
•
350 MHz System Performance  
3.3 V, 66 MHz 64-Bit PCI  
IEEE 1149.1 (JTAG) Boundary Scan Test  
Pin-Compatible Packages across the ProASIC 3E Family  
In-System Programming (ISP) and Security  
®
•
ISP Using On-Chip 128-Bit Advanced Encryption Standard  
(AES) Decryption via JTAG (IEEE 1532–compliant)  
Clock Conditioning Circuit (CCC) and PLL  
®
•
FlashLock Designed to Secure FPGA Contents  
•
•
Six CCC Blocks, Each with an Integrated PLL  
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities  
and External Feedback  
Low Power  
•
•
•
Core Voltage for Low Power  
Support for 1.5-V-Only Systems  
Low-Impedance Flash Switches  
•
Wide Input Frequency Range (1.5 MHz to 350 MHz)  
SRAMs and FIFOs  
•
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,  
and ×18 organizations available)  
High-Performance Routing Hierarchy  
•
•
•
•
•
Segmented, Hierarchical Routing and Clock Structure  
Ultra-Fast Local and Long-Line Network  
Enhanced High-Speed, Very-Long-Line Network  
High-Performance, Low-Skew Global Network  
Architecture Supports Ultra-High Utilization  
•
•
True Dual-Port SRAM (except ×18)  
24 SRAM and FIFO Configurations with Synchronous Operation  
up to 350 MHz  
ARM® Processor Support in ProASIC3E FPGAs  
•
M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available  
with or without Debug  
Table 1-1 • ProASIC3E Product Family  
ProASIC3E Devices  
A3PE600  
A3PE1500  
A3PE3000  
1
Cortex-M1 Devices  
M1A3PE1500  
M1A3PE3000  
System Gates  
600,000  
13,824  
108  
24  
1,500,000  
3,000,000  
VersaTiles (D-flip-flops)  
RAM Kbits (1,024 bits)  
4,608-Bit Blocks  
38,400  
270  
60  
75,264  
504  
112  
1
FlashROM Kbits  
1
1
Secure (AES) ISP  
Yes  
6
Yes  
6
Yes  
6
2
CCCs with Integrated PLLs  
3
VersaNet Globals  
18  
18  
18  
I/O Banks  
8
8
8
Maximum User I/Os  
270  
444  
620  
Package Pins  
PQFP  
FBGA  
PQ208  
FG256, FG484  
PQ208  
FG484, FG676  
PQ208  
FG324, FG484, FG896  
Notes:  
1. Refer to the Cortex-M1 product brief for more information.  
2. The PQ208 package supports six CCCs and two PLLs.  
3. Six chip (main) and three quadrant global networks are available.  
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.  
May 2014  
I
© 2013 Microsemi Corporation  
 
 
 
 
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A3PE600-1FG256I 替代型号

型号 品牌 替代类型 描述 数据表
A3PE600-FG256I MICROSEMI

完全替代

 Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA256
A3PE600-FGG256 MICROSEMI

完全替代

 Field Programmable Gate Array, 13824 CLBs, 600000 Gates, 350MHz, 13824-Cell, CMOS, PBGA256

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A3PE600-1FG484YC MICROSEMI

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A3PE600-1FG484YES MICROSEMI

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A3PE600-1FG484YI MICROSEMI

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A3PE600-1FG484YPP MICROSEMI

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A3PE600-1FG896 MICROSEMI

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