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A3PE3000-2PQG208Y

更新时间： 2024-11-08 12:41:15
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列闪存可编程逻辑栅时钟
页数 文件大小 规格书
162页 8630K
描述
ProASIC3E Flash Family FPGAs with Optional Soft ARM Support

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A3PE3000-2PQG208Y 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：QFP, QFP208,1.2SQ,20Reach Compliance Code：compliant
风险等级：5.82Is Samacsys：N
最大时钟频率：350 MHzJESD-30 代码：S-PQFP-G208
湿度敏感等级：3输入次数：147
逻辑单元数量：75264输出次数：147
端子数量：208最高工作温度：70 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：QFP封装等效代码：QFP208,1.2SQ,20
封装形状：SQUARE封装形式：FLATPACK
电源：1.5/3.3 V可编程逻辑类型：FIELD PROGRAMMABLE GATE ARRAY
认证状态：Not Qualified子类别：Field Programmable Gate Arrays
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子形式：GULL WING
端子节距：0.5 mm端子位置：QUAD
Base Number Matches：1

A3PE3000-2PQG208Y 数据手册

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Revision 13  
ProASIC3E Flash Family FPGAs  
with Optional Soft ARM Support  
Features and Benefits  
Pro (Professional) I/O  
•
•
•
•
700 Mbps DDR, LVDS-Capable I/Os  
High Capacity  
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation  
Bank-Selectable I/O Voltages—up to 8 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /  
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS  
2.5 V / 5.0 V Input  
•
•
•
600 k to 3 Million System Gates  
108 to 504 kbits of True Dual-Port SRAM  
Up to 620 User I/Os  
Reprogrammable Flash Technology  
•
•
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and  
M-LVDS  
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL  
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3  
Class I and II  
•
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS  
Process  
•
•
•
Instant On Level 0 Support  
Single-Chip Solution  
Retains Programmed Design when Powered Off  
•
•
•
•
•
•
•
•
I/O Registers on Input, Output, and Enable Paths  
Hot-Swappable and Cold Sparing I/Os  
Programmable Output Slew Rate and Drive Strength  
Programmable Input Delay  
Schmitt Trigger Option on Single-Ended Inputs  
Weak Pull-Up/-Down  
On-Chip User Nonvolatile Memory  
•
1 kbit of FlashROM with Synchronous Interfacing  
High Performance  
•
•
350 MHz System Performance  
3.3 V, 66 MHz 64-Bit PCI  
IEEE 1149.1 (JTAG) Boundary Scan Test  
Pin-Compatible Packages across the ProASIC 3E Family  
In-System Programming (ISP) and Security  
®
•
ISP Using On-Chip 128-Bit Advanced Encryption Standard  
(AES) Decryption via JTAG (IEEE 1532–compliant)  
Clock Conditioning Circuit (CCC) and PLL  
®
•
FlashLock Designed to Secure FPGA Contents  
•
•
Six CCC Blocks, Each with an Integrated PLL  
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities  
and External Feedback  
Low Power  
•
•
•
Core Voltage for Low Power  
Support for 1.5-V-Only Systems  
Low-Impedance Flash Switches  
•
Wide Input Frequency Range (1.5 MHz to 350 MHz)  
SRAMs and FIFOs  
•
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,  
and ×18 organizations available)  
High-Performance Routing Hierarchy  
•
•
•
•
•
Segmented, Hierarchical Routing and Clock Structure  
Ultra-Fast Local and Long-Line Network  
Enhanced High-Speed, Very-Long-Line Network  
High-Performance, Low-Skew Global Network  
Architecture Supports Ultra-High Utilization  
•
•
True Dual-Port SRAM (except ×18)  
24 SRAM and FIFO Configurations with Synchronous Operation  
up to 350 MHz  
ARM® Processor Support in ProASIC3E FPGAs  
•
M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available  
with or without Debug  
Table 1-1 • ProASIC3E Product Family  
ProASIC3E Devices  
A3PE600  
A3PE1500  
A3PE3000  
1
Cortex-M1 Devices  
M1A3PE1500  
M1A3PE3000  
System Gates  
600,000  
13,824  
108  
24  
1,500,000  
3,000,000  
VersaTiles (D-flip-flops)  
RAM Kbits (1,024 bits)  
4,608-Bit Blocks  
38,400  
270  
60  
75,264  
504  
112  
1
FlashROM Kbits  
1
1
Secure (AES) ISP  
Yes  
6
Yes  
6
Yes  
6
2
CCCs with Integrated PLLs  
3
VersaNet Globals  
18  
18  
18  
I/O Banks  
8
8
8
Maximum User I/Os  
270  
444  
620  
Package Pins  
PQFP  
FBGA  
PQ208  
FG256, FG484  
PQ208  
FG484, FG676  
PQ208  
FG324, FG484, FG896  
Notes:  
1. Refer to the Cortex-M1 product brief for more information.  
2. The PQ208 package supports six CCCs and two PLLs.  
3. Six chip (main) and three quadrant global networks are available.  
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.  
January 2013  
I
© 2013 Microsemi Corporation  
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