Datasheet > A2P75S12M3-F

A2P75S12M3-F

更新时间： 2024-10-16 14:58:19

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		栅双极性晶体管二极管
页数	文件大小	规格书
14页	864K
描述
ACEPACK 2 Sixpack拓扑，1200 V、75 A，沟槽栅场截止IGBT M系列，软二极管和NTC

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A2P75S12M3-F 数据手册

A2P75S12M3-F

Datasheet

ACEPACK™ 2 sixpack topology, 1200 V, 75 A trench gate field-stop IGBT

M series, soft diode and NTC

Features

•

ACEPACK™ 2 power module

DBC Cu Al₂O₃Cu

Sixpack topology

–

•

–

1200 V, 75 A IGBTs and diodes

Soft and fast recovery diode

•

Integrated NTC

ACEPACK™ 2

Applications

•

Inverters

Industrial

Motor drives

Description

This power module is a sixpack topology in an ACEPACK™ 2 package with NTC,

integrating the advanced trench gate field-stop technologies from

STMicroelectronics. This new IGBT technology represents the best compromise

between conduction and switching loss, to maximize the efficiency of any converter

system up to 20 kHz.

Product status

A2P75S12M3-F

Product summary

Order code

A2P75S12M3-F

ACEPACK™ 2

Marking

Package

Leads type

Press fit contact pins

DS11656 - Rev 5 - January 2019

For further information contact your local STMicroelectronics sales office.

www.st.com

12 3 4 5 6 7...14

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