生命周期: | Transferred | 包装说明: | 1 MM PITCH, FBGA-256 |
Reach Compliance Code: | unknown | 风险等级: | 5.75 |
Is Samacsys: | N | JESD-30 代码: | S-PBGA-B256 |
长度: | 17 mm | 可配置逻辑块数量: | 4608 |
等效关口数量: | 200000 | 端子数量: | 256 |
最高工作温度: | 85 °C | 最低工作温度: | |
组织: | 4608 CLBS, 200000 GATES | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, LOW PROFILE | 可编程逻辑类型: | FIELD PROGRAMMABLE GATE ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 1.7 mm |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 17 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
A2F200M3A-FG256I | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256I | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG256Y | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256YC | MICROSEMI |
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FPGA | |
A2F200M3A-FG256YI | MICROSEMI |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG256YI | ACTEL |
获取价格 |
Field Programmable Gate Array, 4608 CLBs, 200000 Gates, CMOS, PBGA256, 1 MM PITCH, FBGA-25 | |
A2F200M3A-FG288 | MICROSEMI |
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SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG288Y | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) | |
A2F200M3A-FG484 | MICROSEMI |
获取价格 |
SmartFusion Customizable System-on-Chip (cSoC) |