Table of Contents
1 Ordering parts.......................................................................................4
5.2.3 FTM module timing....................................................... 18
5.3 Thermal specifications.................................................................19
5.3.1 Thermal operating requirements.................................... 19
5.3.2 Thermal characteristics.................................................. 19
6 Peripheral operating requirements and behaviors................................ 20
6.1 External oscillator (XOSC) and ICS characteristics....................20
6.2 NVM specifications..................................................................... 22
6.3 Analog..........................................................................................23
6.3.1 ADC characteristics....................................................... 23
6.3.2 Analog comparator (ACMP) electricals.........................26
6.4 Communication interfaces........................................................... 26
6.4.1 SPI switching specifications.......................................... 26
6.5 Human-machine interfaces (HMI)...............................................29
6.5.1 TSI electrical specifications........................................... 29
7 Dimensions...........................................................................................30
7.1 Obtaining package dimensions.................................................... 30
8 Pinout................................................................................................... 30
8.1 Signal multiplexing and pin assignments.................................... 30
8.2 Device pin assignment.................................................................33
9 Revision history....................................................................................36
1.1 Determining valid orderable parts............................................... 4
2 Part identification................................................................................. 4
2.1 Description...................................................................................4
2.2 Format..........................................................................................4
2.3 Fields............................................................................................4
2.4 Example....................................................................................... 5
3 Parameter Classification.......................................................................5
4 Ratings..................................................................................................6
4.1 Thermal handling ratings.............................................................6
4.2 Moisture handling ratings............................................................ 6
4.3 ESD handling ratings...................................................................6
4.4 Voltage and current operating ratings..........................................6
5 General................................................................................................. 7
5.1 Nonswitching electrical specifications........................................ 7
5.1.1 DC characteristics.......................................................... 7
5.1.2 Supply current characteristics........................................ 14
5.1.3 EMC performance..........................................................15
5.2 Switching specifications.............................................................. 16
5.2.1 Control timing................................................................ 16
5.2.2 Debug trace timing specifications..................................17
MC9S08PT60 Series Data Sheet, Rev. 5, 06/2015
Freescale Semiconductor, Inc.
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