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935314156557 PDF预览

935314156557

更新时间: 2024-11-09 19:59:51
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
147页 1781K
描述
Multifunction Peripheral

935314156557 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.71
Base Number Matches:1

935314156557 数据手册

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ale Semiconductor  
Data Sheet: Technical Data  
Document Number: MCIMX35SR2AEC  
Rev. 10, 06/2012  
IMX35  
Package Information  
Plastic Package  
Case 5284 17 x 17 mm, 0.8 mm Pitch  
i.MX35 Applications  
Processors for  
Automotive Products  
Ordering Information  
See Table 1 on page 3 for ordering information.  
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
1 Introduction  
The i.MX35 Auto Application Processor family is  
designed for automotive infotainment and navigation  
applications. These processors are AECQ100 Grade 3  
qualified and rated for ambient operating temperatures  
up to 85 °C.  
2
Functional Description and Application Information. . . . . . 4  
2.1. Application Processor Domain Overview. . . . . . . . . 5  
2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6  
2.3. Advanced Power Management Overview . . . . . . . . 6  
2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6  
2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
3. Signal Descriptions: Special Function Related Pins . . . . 12  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13  
4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13  
4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
4.3. Supply Power-Up/Power-Down Requirements and  
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19  
4.6. Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 20  
4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 21  
4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 24  
4.9. Module-Level AC Electrical Specifications. . . . . . . 30  
5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 131  
5.1. MAPBGA Production Package 1568-01, 17 × 17 mm,  
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132  
Based on an ARM11 microprocessor core running at up  
to 532 MHz, the device offers the following features and  
optimized system cost for the target applications.  
Audio connectivity and telematics:  
— Compressed audio playback from storage  
devices (CD, USB, HDD or SD card)  
— PlayFromDevice (1-wire and 2-wire  
support) for portable media players  
— iPod/iPhone control and playback  
— High-speed CD ripping to USB, SD/MMC  
or HDD for virtual CD changer  
5.2. MAPBGA Signal Assignments. . . . . . . . . . . . . . . 133  
6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 145  
7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146  
— Audio processing for hands-free telephony:  
Bluetooth, AEC/NS, and microphone beam  
forming  
— Speech recognition  
© Freescale Semiconductor, Inc., 2010. All rights reserved.  

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