Features and Benefits
0.50 mm (.020") Pitch
LaneLink™ 4x Receptacle
91803 Jackscrew Receptacle
91804 Latch Receptacle
91789 EMI Rear Shield
5 GHZ Bi-directional 4 Lane I/O Connector System with Superior Mechanical Reliability
The Molex 4 Lane I/O connectors incorporate an industry compatible mating interface compliant with
InfiniBand™ requirements. This I/O system has also been adopted by several other standards or MSA groups
in addition to InfiniBand™, noted below. LaneLink™ is a 100 ohm cable to board I/O system optimized for
differential signaling at 2.5 Gbps per pair. The Molex design features superior mechanical reliability and an
extensive range of options including Latching and Jackscrews versions.
A recent feature to both 4x options is the addition of a landing area for automated Pick and Place.
EMI shielding has now been improved by adding a rear EMI shield to reduce EMC/EMI leakages.
Features/Receptacle
Benefits
■ Die cast frame with unitary latch posts and screw ■ Provides the best available strain relief of cable to
attach to PCB
socket and isolates cable loads from SMT tails
■ Optional top mount attach of die cast frame
to chassis
■ Additional strain relief
■ Dedicated pick and place landing area
■ Solder post options (2 or 4 posts)
■ Various PCB thickness accommodated
■ High level of pin to PCB compliancy
■ Extended crush pin alignment posts
■ Jackscrew option complies with SFF-8470
■ Allows use of standard pick and place nozzles
■ Replaces need for screw down
■ Allows customer to use various PCB options
■ Helps coplanarity
■ Eases alignment of connector to board
SPECIFICATIONS
Mechanical
Reference Information
Packaging: Tray, Tape and Reel
Mates With:
Contact Retention to Housing: 5N (1.12 lb) min
Mating Force: 55.5N (12.33 lb) max for 4x; 73N
(16.37 lb) max for 12x
91804 to 91635;
Unmating Force: 7.0N (1.57 lb) min for 4x; 10.5N
(2.35 lb) min for 12x; 49.0N (10.99 lb) max for 4x;
59.0N (13.23 lb) min for 12x
91803 to 91659;
91789 to 91803 or 91804
Designed In: Millimeters
Latch
Durability: 250 cycles
Electrical
Voltage: 30 V AC max
Physical
Housing: LCP, UL 94V-0
Current: 0.5 A max
Contact Resistance: 80 milliohms
Dielectric Withstanding Voltage: 300 V AC
Insulation Resistance: 1000 Megohms
Contact: Phosphor Bronze
Plating: Contact Area – Gold over Palladium Nickel
Solder Tail Area – Tin
Jackscrew
Underplating – Nickel
PCB Thickness: 1.60 mm (.063"), 2.40 mm (.094"),
4.00 mm (.157")
Operating Temperature: –20 to 60 °C