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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| 87381-2664 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Milli-Grid Receptacle, Surface Mount, Top Entry, 0.38um (15u") Gold ( |
|
| 87381-2674 | MOLEX |
获取价格 |
Board Connector, 26 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Recept |
|
| 87381-268 | AMPHENOL |
获取价格 |
Board Connector, 68 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 87381-270 | AMPHENOL |
获取价格 |
Board Connector, 70 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 87381-272 | AMPHENOL |
获取价格 |
Board Connector, 72 Contact(s), 2 Row(s), Male, Straight, Solder Terminal |
|
| 87381-272H | AMPHENOL |
获取价格 |
Board Connector, 72 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| 87381-272HLF | AMPHENOL |
获取价格 |
BERGSTIK II 0.100" DUAL ST |
|
| 87381-2807 | MOLEX |
获取价格 |
Board Connector, 28 Contact(s), 2 Row(s), Female, Straight, 0.079 inch Pitch, Surface Moun |
|
| 87381-2815 | MOLEX |
获取价格 |
Board Connector, 28 Contact(s), 2 Row(s), Female, Straight, 0.079 inch Pitch, Surface Moun |
|
| 87381-2817 | MOLEX |
获取价格 |
2.00mm (.079") Pitch Milli-Grid™ Receptacle, |
|
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
AMD宣布全球裁员约1000人，调整战略聚焦增长
英伟达新AI芯片Rubin或提前半年亮相
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