Datasheet > 853S111AYILFT

853S111AYILFT

更新时间： 2024-01-24 05:32:58

品牌	Logo	应用领域
艾迪悌 - IDT		/
页数	文件大小	规格书
20页	298K
描述
Differential-to-LVPECL/ECL Fanout Buffer

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

853S111AYILFT 数据手册

853S111AI DATA SHEET

Power Considerations

This section provides information on power dissipation and junction temperature for the 853S111AI.

Equations and example calculations are also provided.

1. Power Dissipation.

The total power dissipation for the 853S111AI is the sum of the core power plus the power dissipated in the load(s).

The following is the power dissipation for V_CC= 3.465V, which gives worst case results.

NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.

•

Power (core)_MAX= V_{CC_MAX}* I_{EE_MAX}= 3.465V * 74mA = 256.41mW

Power (outputs)_MAX= 32.59mW/Loaded Output pair

If all outputs are loaded, the total power is 10 * 32.59mW = 325.90mW

Total Power__MAX(3.8V, with all outputs switching) = 256.41mW + 325.90mW = 582.31mW

2. Junction Temperature.

Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The

maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond

wire and bond pad temperature remains below 125°C.

The equation for Tj is as follows: Tj = _JA* Pd_total + T_A

Tj = Junction Temperature

_JA= Junction-to-Ambient Thermal Resistance

Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)

T_A= Ambient Temperature

In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance _JAmust be used. Assuming a moderate air

flow of 2.5 meter per second and a multi-layer board, the appropriate value is 67.7°C/W per Table 6 below.

Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:

85°C + 0.582W * 67.7°C/W = 124.4°C. This is below the limit of 125°C.

This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of

board (multi-layer).

Table 6. Thermal Resistance _JAfor 32 Lead LQFP, Forced Convection

_JAby Velocity

Meters per Second

2.5

Multi-Layer PCB, JEDEC Standard Test Boards

80.9°C/W

71.4°C/W

67.7°C/W

Rev A 6/30/15

LOW SKEW, 1-TO-10, DIFFERENTIAL-TO-LVPECL/ECL FANOUT

BUFFER

1...11 12 131415 16 17...20

下载PDF

与853S111AYILFT相关器件

型号	品牌	描述	获取价格	数据表
853S111B	IDT	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer	获取价格
853S111B_16	IDT	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer	获取价格
853S111B_17	IDT	Low Skew Different ial-to-2 .5V, 3.3V LVPECL/ECL	获取价格
853S111BI	RENESAS	Low Skew, 1-to-10 Differential-to-2.5V, 3.3V LVPECL / ECL Fanout Buffer	获取价格
853S111BKILF	IDT	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer	获取价格
853S111BKILF/W	IDT	Low Skew, 1-to-10, Differential-to-2.5V, 3.3V LVPECL/ECL Fanout Buffer	获取价格