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853054AG PDF预览

853054AG

更新时间: 2024-01-31 00:46:20
品牌 Logo 应用领域
艾迪悌 - IDT 光电二极管逻辑集成电路
页数 文件大小 规格书
16页 422K
描述
Multiplexer And Demux/Decoder, PDSO16

853054AG 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ObsoleteReach Compliance Code:not_compliant
HTS代码:8542.39.00.01风险等级:5.92
JESD-30 代码:R-PDSO-G16JESD-609代码:e0
逻辑集成电路类型:MULTIPLEXER AND DEMUX/DECODER湿度敏感等级:1
端子数量:16最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):225电源:2.5/3.3 V
Prop。Delay @ Nom-Sup:0.625 ns认证状态:Not Qualified
子类别:Clock Drivers表面贴装:YES
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn85Pb15)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
Base Number Matches:1

853054AG 数据手册

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PRELIMINARY  
ICS853054  
4:1, DIFFERENTIAL-TO-3.3V OR 2.5V LVPECL/ECL CLOCK MULTIPLEXER  
TSD  
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS853054.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS853054 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 61mA = 211.37mW  
Power (outputs)MAX = 27.83mW/Loaded Output pair  
Total Power_MAX (3.465V, with all outputs switching) = 211.37mW + 27.83mW = 239.2mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = junction-to-AmbientThermal Resistance  
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 meters per second and a multi-layer board, the appropriate value is 81.8°C/W perTable 6 below.  
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:  
85°C + 0.239W * 81.8°C/W = 104.6°C. This is well below the limit of 125°C.  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 6. THERMAL RESISTANCE θJA FOR 16-PIN TSSOP FORCED CONVECTION  
θJA byVelocity (Meters per Second)  
0
200  
118.2°C/W  
81.8°C/W  
500  
106.8°C/W  
78.1°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
137.1°C/W  
89.0°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
IDT™ / ICS™ 4:1, DIFFERENTIAL-TO-3.3V OR 2.5V LVPECL/ECL CLOCK MULTIPLEXER  
ICS853054  
11  

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