INTERCONNECTS
1,27 Grid
Series 850, 851
852, 853
Single and Double Row
● Series 850 single and double row
interconnects have 1,27pin
spacing and permit board stacking
as low as 6,3.
(Number of Pins
X 1,27) + 0,38
2,21
0,41
0,41
3,0
● Pin headers have 0,41dia. pins.
(MM# 4006-0 see page 166 for details).
2,21
● MM# 4890-0 and 0467 receptacles
use M-M#11 Hi-Rel, 3-finger beryl-
lium copper contacts rated at 3amps.
(#11 contact accepts pin diameters
from 0,38 - 0,51)
2,9
1,27
Fig. 1
● Insulators are high temp. thermo-
plastic, suitable for all soldering
operations.
(Number of Pins
X 1,27/2) + 0,38
3,05
0,41
0,41
3,0
Ordering Information
1,91
2,11
3,0
Single Row
2,21 Profile Pin Header
850-XX-0_ _-10-001000
Fig. 1
Fig. 2
Specify # of pins
Double Row
01-50
1,27
1,27
Fig. 2
1,91 Profile Pin Header
(Number of Pins
X 1,27 ) + 0,38
2,21
852-XX-_ _ _-10-001000
Specify # of pins
002-100
1,91
3,05
4,09
2,51
XX= Plating Code
0,46
See Below
1,27
SPECIFY PLATING CODE XX=
Pin Plating
10
90
40
Fig. 3
0,25µm Au
5,08µm Sn/Pb 5,08µm Sn
(Number of Pins
X 1,27/2) + 0,38
Single Row
4,09 Profile Socket
3,05
Fig. 3
Fig. 4
Fig. 5
851-XX-0_ _-10-001000
1,91
3,05
4,01
2,59
Specify # of pins
01-50
0,46
Double Row
4,09 Profile Socket
853-XX-_ _ _-10-001000
1,27
1,27
Specify # of pins
Single Row
002-100
Fig. 4
4,7 Profile Socket
(Number of Pins
X 1,27 ) + 1,02
1,78
851-XX-0_ _-10-002000
1,91
Specify # of pins
01-77
3,81
4,7
XX= Plating Code
See Below
0,46
2,92
SPECIFY PLATING CODE XX= 13
91
93
99
41 43 44
1,27
Sleeve (Pin)
200µ” Sn/Pb
200µ”Sn
5,08µm Sn/Pb
5,08µm Sn 5,08µm Sn
5,08µm Sn/Pb
0,76µm Au 5,08µm Sn
5,08µm Sn/Pb 10µ” Au
0,76µm Au
0,25µm Au
Fig. 5
0,76µm Au 10µ” Au
Contact (Clip)
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516-922-6000
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