Datasheet > 850-90-018-10-001

850-90-018-10-001

更新时间： 2024-11-12 04:38:03

品牌	Logo	应用领域
仕元机械 - MILL-MAX		/
页数	文件大小	规格书
1页	185K
描述
Board Connector, 18 Contact(s), 1 Row(s), Male, Straight, Solder Terminal

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850-90-018-10-001 数据手册

INTERCONNECTS

.050” Grid

Series 850, 851

852, 853

Single and Double Row

• Series 850 single and double row

interconnects have .050” pin

spacing and permit board stacking

as low as .248”.

• Pin headers have .017” dia. pins.

(MM# 3006 see page 166 for details).

• MM# 0489 and 0467 receptacles

use M-M#11 Hi-Rel, 3-finger beryl-

lium copper contacts rated at 3amps.

(#11 contact accepts pin diameters

from .015-.020)

Fig. 1

• Insulators are high temp. thermo-

plastic, suitable for all soldering

operations.

Ordering Information

Single Row

.087” Profile Pin Header

850-XX-0_ _-10-001

Fig. 1

Fig. 2

Specify # of pins

Double Row

01-50

Fig. 2

.075” Profile Pin Header

852-XX-_ _ _-10-001

Specify # of pins

002-100

XX= Plating Code

See Below

SPECIFY PLATING CODE XX=

Pin Plating

Fig. 3

10µ” Au

200µ” Sn/Pb

Single Row

.161” Profile Socket

Fig. 3

Fig. 4

Fig. 5

851-XX-0_ _-10-001

Specify # of pins

01-50

Double Row

.161” Profile Socket

853-XX-_ _ _-10-001

Specify # of pins

Single Row

002-100

Fig. 4

.185” Profile Socket

(Number of Pins

X .050”) + .040”

851-XX-0_ _-10-002

Specify # of pins

01-77

XX= Plating Code

See Below

SPECIFY PLATING CODE XX=

Sleeve (Pin)

200µ” Sn/Pb 200µ”Sn/Pb

30µ” Au 200µ”Sn/Pb

Fig. 5

Contact (Clip)

www.mill-max.com

ꢀ

516-922-6000

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