Datasheet > 84520-102

84520-102

更新时间： 2024-10-02 14:32:31

品牌	Logo	应用领域
安费诺 - AMPHENOL		PC 连接器
页数	文件大小	规格书
6页	253K
描述
Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking Mech, Plug,

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84520-102 数据手册

boarD to boarD connEctors

MEG-ARRAY^®MEZZANINE CONNECTOR SYSTEM

HiGH DEnsity, bGa DEsiGn EXcEls at HiGH spEED pErForMancE anD rEliability

DEscription

The MEG-Array Mezzanine Connector

system provides the high density and high

speed beneﬁts of a large array supported by

the reliability and low costs of standard surface

mount PCB assembly.

1.27mm x 1.27mm array of discrete circuit

contacts allows ﬂexible ground distribution to

optimize high speed signal integrity at speeds

exceeding 10 Gb/s. MEG-Array is offered in a

variety of PCB mezzanine stack heights.

FCI’s advanced manufacturing supports a

patented BGA interconnect design. Multiple

in-process vision systems monitor BGA contact

integrity including solder sphere size, location

and co-planarity plus other critical-to-function

attributes.

tarGEt MarkEts /

applications

FEaturEs & bEnEFits

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10 Gb/s differential pair performance with under 1% cross-talk

28 Gb/s high speed performance documented for 4mm and 6mm

stack height

COMMUNICATIONS

Transmission

Access

Switching

Online s-parameter ﬁles and signal integrity performance reports

improve design accuracy and time-to-market

Optics

1.27mm x 1.27mm grid provides 71 contacts per cm2 density to

save space

Networking

DATA

Wide range of sizes and PCB stack heights increase mechanical

design ﬂexibility

Servers

Storage

6 PCB Stack heights: 4mm to 14mm

8 sizes: 81 to 528 positions

I & I

Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lowers assembly costs by

using standard SMT processes

Industrial controls & equipment

Analytical & diagnostic

Medical

BGA natural surface tension provides self-alignment and self-leveling

for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance

Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and

NPS-25298-2 options

22+ year solder joint reliability per IPC-SM-785

17 Billion + lines shipped to customer satisfaction

Precious metal plating options satisfy varying customer needs for

environmental resistance

12 3 4 5 6

中文翻译

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与84520-102相关器件

型号	品牌	获取价格	描述	数据表
84520-102LF	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-202	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-202LF	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-292	AMPHENOL	获取价格	Board Stacking Connector
845204AK	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKLF	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKLFT	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKT	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
8452-11B1-RK-TP	3M	获取价格	IC SOCKET
8452-21A1-RK-TP	3M	获取价格	3Mâ¢ Chip Carrier Sockets

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