Datasheet > 84520-102

84520-102

更新时间： 2024-11-24 14:32:31

品牌	Logo	应用领域
安费诺 - AMPHENOL		PC 连接器
页数	文件大小	规格书
6页	253K
描述
Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Locking Mech, Plug,

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

84520-102 数据手册

boarD to boarD connEctors

MEG-ARRAY^®MEZZANINE CONNECTOR SYSTEM

HiGH DEnsity, bGa DEsiGn EXcEls at HiGH spEED pErForMancE anD rEliability

DEscription

The MEG-Array Mezzanine Connector

system provides the high density and high

speed beneﬁts of a large array supported by

the reliability and low costs of standard surface

mount PCB assembly.

1.27mm x 1.27mm array of discrete circuit

contacts allows ﬂexible ground distribution to

optimize high speed signal integrity at speeds

exceeding 10 Gb/s. MEG-Array is offered in a

variety of PCB mezzanine stack heights.

FCI’s advanced manufacturing supports a

patented BGA interconnect design. Multiple

in-process vision systems monitor BGA contact

integrity including solder sphere size, location

and co-planarity plus other critical-to-function

attributes.

tarGEt MarkEts /

applications

FEaturEs & bEnEFits

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10 Gb/s differential pair performance with under 1% cross-talk

28 Gb/s high speed performance documented for 4mm and 6mm

stack height

COMMUNICATIONS

Transmission

Access

Switching

Online s-parameter ﬁles and signal integrity performance reports

improve design accuracy and time-to-market

Optics

1.27mm x 1.27mm grid provides 71 contacts per cm2 density to

save space

Networking

DATA

Wide range of sizes and PCB stack heights increase mechanical

design ﬂexibility

Servers

Storage

6 PCB Stack heights: 4mm to 14mm

8 sizes: 81 to 528 positions

I & I

Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lowers assembly costs by

using standard SMT processes

Industrial controls & equipment

Analytical & diagnostic

Medical

BGA natural surface tension provides self-alignment and self-leveling

for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance

Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and

NPS-25298-2 options

22+ year solder joint reliability per IPC-SM-785

17 Billion + lines shipped to customer satisfaction

Precious metal plating options satisfy varying customer needs for

environmental resistance

12 3 4 5 6

中文翻译

下载PDF

与84520-102相关器件

型号	品牌	获取价格	描述	数据表
84520-102LF	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-202	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-202LF	AMPHENOL	获取价格	Board Stacking Connector, 400 Contact(s), 10 Row(s), Male, Straight, 0.05 inch Pitch, Surf
84520-292	AMPHENOL	获取价格	Board Stacking Connector
845204AK	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKLF	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKLFT	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
845204AKT	IDT	获取价格	CRYSTAL-TO-MLVDS PCI EXPRESS™ CLOCK SYNTHESIZ
8452-11B1-RK-TP	3M	获取价格	IC SOCKET
8452-21A1-RK-TP	3M	获取价格	3Mâ¢ Chip Carrier Sockets

与84520-102相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

39
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

31
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

59
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

55

产品中心

服务支持

精选活动

关于我们

帮助中心

84520-102

84520-102 数据手册

与84520-102相关器件

与84520-102相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

84520-102

84520-102 数据手册

与84520-102相关器件

与84520-102相关文章

您还可以找

您在本页遇到什么问题？