Datasheet > 插座 > 插槽和芯片载体> 8452-21B1-RK-TR

8452-21B1-RK-TR

更新时间： 2024-11-27 12:56:15

品牌	Logo	应用领域
3M		插座插槽和芯片载体
页数	文件大小	规格书
3页	812K
描述
3Mâ¢ Chip Carrier Sockets

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技术参数
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8452-21B1-RK-TR 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8536.69.40.40	风险等级：	5.62
Is Samacsys：	N	其他特性：	STANDARD: UL 94V-0
联系完成配合：	MATTE TIN (160) OVER NICKEL (50)	触点材料：	PHOSPHOR BRONZE
设备插槽类型：	IC SOCKET	外壳材料：	GLASS FILLED POLYPHENYLENE SULFIDE
触点数：	52	Base Number Matches：	1

8452-21B1-RK-TR 数据手册

3M^™Chip Carrier Sockets

Surfacemount

8400 Series

•ꢀ Accepts chip carriers conforming to JEDEC outline

MO-047 for square and MO-052 for rectangular

•ꢀ High temperature insulator compatible with IR reﬂow

and wave soldering

•ꢀ Compatible with automated loading equipment

•ꢀ Open top design allows unrestricted air ﬂow

•ꢀ Molded slots for ease of device extraction

•ꢀ Available with optional PCB locating posts

•ꢀ RoHS Compliant. See the Regulatory Information

Appendix (RIA) in the "RoHS Compliance" section

of www.3Mconnector.com for compliance

information (RIA E1 and C1 apply)

Date Modiﬁed: September 14, 2011

TS-2147-B

Sheet 1 of 2

Physical

Insulation

Material: Glass Filled Polyphenylene Sulﬁde (PPS)

Flammability: UL 94V-0

Color: Black

Contact

Material:

CopperAlloy

Plating

Underplating: 50 µ" [ 1.27 µm ] Nickel - Overall

WipingArea: 160 µ", [ 4.06 µm ] Matte Tin

Electrical

Contact Resistance: 15 mΩ

Insulation Resistance: >10³MΩ minimum

<1 pF at 1 MHz

Capacitance:

Environmental

-40ºC to +105ºC

Temperature Rating:

Maximum 260°C, single pass, (proﬁle per J-STD-020C)

1 (per J-STD-020C)

Process Rating:

Moisture Sensitivity Level:

Notice:

Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin

whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after

mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC

socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have

been shown to stimulate tin whisker growth.

3M is a trademark of 3M Company.

For technical, sales or ordering information call

Electronic Solutions Division

Interconnect Solutions

800-225-5373

http://www.3Mconnectors.com

12 3

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