INTERCONNECTS
OFP Pass Thru Sockets for Ø.030” & .025” pins
Single and Double Row
Series 834, 835
®
ꢀ
• 834/835 Series Pass Thru Sockets have a low
.130” profile and will accept Ø.030” round pin,
as well as industry standard .025” square pin
headers.
• They are typically used to interconnect two or
more parallel circuit boards.
• Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
®
• Unique ORGANIC FIBRE PLUG barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
®
OFP barriers are pushed out of the socket
when the mating header is inserted.
• Mill-Max sockets use a precision machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
Typical Application
500%2
#)2#5)4
"/!2$
).4%2ꢆ#/..%#4)/.
0).
• Recommended mounting holes are Ø.046
ꢀꢁꢂꢁꢃ OR
ꢀꢀꢁꢄꢅꢃ 0).3
.003” PTH (1,2 mm drilled prior to plating).
ꢇꢈꢉ 302).'
#/.4!#4
*Intrusive reflow (also called "pin-in-paste") is a tech-
nique of using conventional thru-hole components
in a reflow soldering process. The pass thru socket
is placed into plated-thru-holes in the circuit board
(solder paste has previously been screen printed on
pads adjacent to the holes) and the board is
-)$$,%
#)2#5)4
"/!2$
3/#+%4
).35,!4/2
0!33 4(25
3/#+%43
3/#+%4
3,%%6%
reflowed in the same pass as other SMT compo-
nents. Solder will fill the plated-thru-holes and
achieve solder joints as reliable as wave soldering.
#)2#5)4
"/!2$
,/7%2
#)2#5)4
"/!2$
®
The OFP barrier prevents solder paste from being
picked-up inside the contact during assembly.
¸
/2'!.)# &)"%2 0,5'
3/,$%2
*/).4
053(%$ /54 "9 ).4%2ꢆ#/..%#4
0). !&4%2 3/,$%2).'
2O(3
ꢄꢁꢁꢄꢊꢋꢅꢊ%#
US Patent #7,086,870
Ordering Information
®
Single Row OFP Pass Thru Socket
834-XX-0 _ _-10-001000
Fig. 1
Fig. 2
Specify # of pins
®
01-64
®
Fig. 1
Double Row OFP Pass Thru Socket
835-XX-0 _ _-10-001000
Specify # of pins
02-72
For RoHS compliance
select plating code.
XX= Plating Code
See Below
ꢁ
SPECIFY PLATING CODE XX= 13
ꢁ
93
10µ” Au 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn
30µ” Au 30µ” Au 200µ”Sn/Pb 30µ” Au 200µ”Sn
99
43
ꢁ
44
ꢁ
®
Sleeve (Pin)
Fig. 2
Contact (Clip)
www.mill-max.com
ꢀ
516-922-6000
85