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835-13-014-10-001000 PDF预览

835-13-014-10-001000

更新时间: 2024-11-05 20:41:23
品牌 Logo 应用领域
仕元机械 - MILL-MAX 连接器
页数 文件大小 规格书
1页 166K
描述
Board Connector, 14 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT

835-13-014-10-001000 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:ROHS COMPLIANT
Reach Compliance Code:compliant风险等级:5.75
主体/外壳类型:SOCKET连接器类型:BOARD CONNECTOR
联系完成配合:GOLD (30) OVER NICKEL (100)联系完成终止:GOLD (10)
触点性别:FEMALE触点材料:NOT SPECIFIED
DIN 符合性:NO滤波功能:NO
IEC 符合性:NOJESD-609代码:e4
MIL 符合性:NO混合触点:NO
安装方式:STRAIGHT安装类型:BOARD
装载的行数:2选件:GENERAL PURPOSE
端子节距:2.54 mm端接类型:SOLDER
触点总数:14Base Number Matches:1

835-13-014-10-001000 数据手册

  
INTERCONNECTS  
OFP Pass Thru Sockets for Ø.030” & .025” pins  
Single and Double Row  
Series 834, 835  
®
834/835 Series Pass Thru Sockets have a low  
.130” profile and will accept Ø.030” round pin,  
as well as industry standard .025” square pin  
headers.  
They are typically used to interconnect two or  
more parallel circuit boards.  
Sockets are designed for hand, wave or reflow*  
soldering. The high temp. insulator is compati-  
ble with all solder processes.  
®
Unique ORGANIC FIBRE PLUG barriers pre-  
vent solder, paste or flux from contaminating  
the internal spring contacts. After soldering, the  
®
OFP barriers are pushed out of the socket  
when the mating header is inserted.  
Mill-Max sockets use a precision machined  
brass sleeve with a press-fit beryllium copper  
“multi-finger” spring contact.  
Typical Application  
500%2  
#)2#5)4  
"/!2$  
).4%2ꢆ#/..%#4)/.  
0).  
Recommended mounting holes are Ø.046  
Œꢀꢁꢂꢁꢃ OR  
ꢀꢁꢄꢅꢃ 0).3  
.003” PTH (1,2 mm drilled prior to plating).  
ꢇꢈꢉ 302).'  
#/.4!#4  
*Intrusive reflow (also called "pin-in-paste") is a tech-  
nique of using conventional thru-hole components  
in a reflow soldering process. The pass thru socket  
is placed into plated-thru-holes in the circuit board  
(solder paste has previously been screen printed on  
pads adjacent to the holes) and the board is  
-)$$,%  
#)2#5)4  
"/!2$  
3/#+%4  
).35,!4/2  
0!33 4(25  
3/#+%43  
3/#+%4  
3,%%6%  
reflowed in the same pass as other SMT compo-  
nents. Solder will fill the plated-thru-holes and  
achieve solder joints as reliable as wave soldering.  
#)2#5)4  
"/!2$  
,/7%2  
#)2#5)4  
"/!2$  
®
The OFP barrier prevents solder paste from being  
picked-up inside the contact during assembly.  
¸
/2'!.)# &)"%2 0,5'  
3/,$%2  
*/).4  
053(%$ /54 "9 ).4%2ꢆ#/..%#4  
0). !&4%2 3/,$%2).'  
2O(3  
ꢄꢁꢁꢄꢊꢋꢅꢊ%#  
US Patent #7,086,870  
Ordering Information  
®
Single Row OFP Pass Thru Socket  
834-XX-0 _ _-10-001000  
Fig. 1  
Fig. 2  
Specify # of pins  
®
01-64  
®
Fig. 1  
Double Row OFP Pass Thru Socket  
835-XX-0 _ _-10-001000  
Specify # of pins  
02-72  
For RoHS compliance  
select plating code.  
XX= Plating Code  
See Below  
SPECIFY PLATING CODE XX= 13  
93  
10µ” Au 200µ” Sn/Pb 200µSn/Pb 200µSn 200µ”Sn  
30µ” Au 30µ” Au 200µSn/Pb 30µ” Au 200µSn  
99  
43  
44  
®
Sleeve (Pin)  
Fig. 2  
Contact (Clip)  
www.mill-max.com  
516-922-6000  
85  

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