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8-535542-8

更新时间: 2024-01-15 02:36:23
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页数 文件大小 规格书
98页 4308K
描述
Mod IV Receptacle Assemblies, Single-Row, Outrigger Design .100 x .100 [2.54 x 2.54] Centerline, End To End Stackable

8-535542-8 数据手册

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AMPMODU Interconnection System  
Mod IV Receptacle Assemblies, Single-Row, Outrigger Design  
.100 x .100 [2.54 x 2.54] Centerline, End To End Stackable  
.125 .010  
[3.17 0.25]  
Typ.  
Dual Entry, End Stackable,  
Low Profile, .100 x .100  
[2.54 x 2.54] Centerline,  
.200 [5.08] Tine Spacing  
.020  
[0.51]  
(Standoffs)  
.245  
[6.22]  
.148  
[3.77]  
Typ.  
A
Point of  
Contact  
.107  
[2.72]  
(Localized Gold  
Plate Area)  
.200 .003  
[5.08 0.08]  
Typ.  
Material and Finish  
Housing — Glass-filled thermoplastic,  
black, 94V-0 rated  
.140  
[3.56]  
.053  
[1.34]  
Typ.  
.100  
[2.54]  
Typ.  
Plating A — Duplex .000030 [0.00076]  
gold on contact area, .000150-0.000300  
[0.00381-0.00762] matte tin on solder  
area all over .000050 [0.00127] nickel  
Plating B — Duplex .000010  
[0.000254] gold on contact area,  
.000150-.000300 [0.00381-0.00762]  
matte tin on solder area all over .000050  
[0.00127] nickel  
B
+.005  
-.000  
+0.13  
-.000  
.075  
1.90  
[
]
.200  
[5.08]  
Plating C — .000150-.000300  
[0.00381-0.00762] matte tin on solder  
leads, all over .000050 [0.00127] nickel  
.140  
[3.56]  
.100  
[2.54]  
Typ.  
.035 .003  
[0.89 0.08]  
Dia.  
Recommended PC Board Hole Layout  
5
Dimensions  
Contact Plating/Part Nos.  
Plating B  
No. of  
Pos.  
A
B
Plating A  
Plating C  
3
.300 [7.62]  
.400 [10.16]  
.500 [12.70]  
.600 [15.24]  
.700 [17.78]  
.800 [20.32]  
.900 [22.86]  
1.000 [25.40]  
1.100 [27.94]  
1.200 [30.48]  
1.300 [33.02]  
1.400 [35.56]  
1.500 [38.10]  
1.600 [40.64]  
1.700 [43.18]  
1.800 [45.72]  
1.900 [48.26]  
2.000 [50.80]  
3.000 [76.20]  
4.000 [101.60]  
.200 [5.08]  
.300 [7.62]  
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4
5
.400 [10.16]  
.500 [12.70]  
.600 [15.24]  
.700 [17.78]  
.800 [20.32]  
.900 [22.86]  
1.000 [25.40]  
1.100 [27.94]  
1.200 [30.48]  
1.300 [33.02]  
1.400 [35.56]  
1.500 [38.10]  
1.600 [40.64]  
1.700 [43.18]  
1.800 [45.72]  
1.900 [48.26]  
2.900 [73.66]  
3.900 [99.06]  
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
30  
40  
Notes: 1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle  
assemblies.  
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to  
the maximum point-of-contact dimension and add .062 [1.57] for recommended board thickness if used in  
bottom entry application.  
Note: All part numbers are RoHS  
compliant.  
181  
Catalog 1307819  
Revised 8-08  
Dimensions are in inches and  
Dimensions are shown for  
reference purposes only.  
Specifications subject  
to change.  
USA: 1-800-522-6752  
South America: 55-11-2103-6000  
Hong Kong: 852-2735-1628  
Japan: 81-44-844-8013  
millimeters unless otherwise  
specified. Values in brackets  
are metric equivalents.  
Canada: 1-905-470-4425  
Mexico: 01-800-733-8926  
C. America: 52-55-1106-0803  
www.tycoelectronics.com  
UK: 44-8706-080-208  

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