ADVANCE
S27KL0641, S27KS0641
HyperRAM™ Self-Refresh DRAM
3.0V/1.8V 64 Mb (8 MB)
Distinctive Characteristics
HyperBus™ Low Signal Count Interface
High Performance
3.0V I/O, 11 bus signals
– Single ended clock (CK)
1.8V I/O, 12 bus signals
– Differential clock (CK, CK#)
Chip Select (CS#)
Up to 333MB/s
Double-Data Rate (DDR) - two data transfers per clock
166-MHz clock rate (333 MB/s) at 1.8V VCC
100-MHz clock rate (200 MB/s) at 3.0V VCC
Sequential burst transactions
Configurable Burst Characteristics
– Wrapped burst lengths:
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
– Bidirectional Data Strobe / Mask
– 16 bytes (8 clocks)
– Output at the start of all transactions to indicate refresh
latency
– 32 bytes (16 clocks)
– 64 bytes (32 clocks)
– Output during read transactions as Read Data Strobe
– Input during write transactions as Write Data Mask
– 128 bytes (64 clocks)
– Linear burst
– Hybrid option - one wrapped burst followed by linear burst
– Wrapped or linear burst type selected in each transaction
– Configurable output drive strength
Package and Die Options
RESET#
V
CC
V
Q
CC
CS#
CK
DQ[7:0]
RWDS
– 24-ball FBGA footprint
CK#
V
SS
V
Q
SS
Performance Summary
Read Transaction Timings
Maximum Current Consumption
Maximum Clock Rate at 1.8V VCC/VCC
Maximum Clock Rate at 3.0V VCC/VCC
Q
Q
166 MHz
100 MHz
36 ns
Burst Read or Write (linear burst at 166 MHz, 1.8V) 60 mA
Power On Reset
50 mA
300 µA
40 µA
Maximum Access Time, (tACC at 166 MHz)
Standby (CS# = High, 3V, 105 °C)
Deep Power Down (CS# = High, 3V, 105 °C)
Standby (CS# = High, 1.8V, 105 °C)
Deep Power Down (CS# = High, 1.8V, 105 °C)
Maximum CS# Access Time to first word at
166 MHz (excluding refresh latency)
56 ns
300 µA
20 µA
Errata: For information on silicon errata, see "Errata” on page 27. Details include trigger conditions, devices affected, and proposed workaround.
Cypress Semiconductor Corporation
Document Number: 001-97964 Rev. *E
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198 Champion Court
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San Jose, CA 95134-1709
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408-943-2600
Revised March 01, 2016