Datasheet > 78588-1552

78588-1552

更新时间： 2024-11-02 12:23:47

品牌	Logo	应用领域
莫仕 - MOLEX		双倍数据速率
页数	文件大小	规格书
3页	215K
描述
Ultra-Low-Profile DDR3 DIMM Sockets

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78588-1552 数据手册

Ultra-Low-Proﬁle

DDR3 DIMM

Sockets

78588 1.10mm Seating Plane,

Low-Level Contact

Molex’s ultra-low-proﬁle DDR3 DIMM sockets optimize

vertical space- and power-savings in ATCA* blade

systems using high-density memory modules

DDR3 is an established DDR DRAM interface technology that offers

more bandwidth and higher performance at lower power for demanding

memory applications in desktop PCs, servers and notebook computers.

It ﬁnds expanding use for high-performance embedded systems in

telecommunication, networking and storage systems, advanced computing

platforms and industrial controls. DDR3 supports data rates of 800 to 1600

Mbps with clock frequencies of 400 to 800 MHz (respectively); effectively

doubling the speed of DDR2. With a standard operating voltage of 1.5V,

DDR3 cuts power consumption of DDR2 by up to 30%.

Resistance (LLCR),

Through Hole, Vertical,

240 circuits Halogen-

free, Lead-free

A leading manufacturer of internal memory module sockets, Molex offers

Ultra-Low-Proﬁle DDR3 DIMM sockets with Low Level Contact Resistance

only 10milliohms (maximum initial). These sockets support the unregistered

DDR3 DIMMs as well as Registered DIMMs (RDIMMs) for reduced power

consumption in data systems.

With a seating plane of only 1.10mm – the lowest known in the industry

– the sockets provide optimum design ﬂexibility by allowing the use of

very low-proﬁle memory modules with seating heights below 2.80mm

(maximum) in ATCA blade systems. For applications requiring conformance

to ATCA Board Mechanics Speciﬁcations where component heights cannot

exceed 21.33mm from ‘side 1 of the front board PCB’ (speciﬁcation

deﬁnitions), these sockets are excellent as they free up to 20.23mm of

vertical space above the PCB for the mounting of high-density DIMMs.

The sockets’ reduced latch-actuation angles use less PCB real-estate than

standard DIMM sockets to enable the addition of neighbouring components.

The ultra-low-proﬁle DIMM sockets also have a smaller overall (7.40 by

155.00mm) real estate than that according to JEDEC Speciﬁcations (7.75 by

165.00mm), making them space-savers for complex base stations, server

farms and voice gateways where chassis mechanics, power, thermal and

airﬂow conditions are critical design factors.

The ultra-low-proﬁle DDR3 DIMM socket

(left) has a lower seating-plane than

standard DDR3 DIMM versions (right)

The sockets have glass-ﬁlled, high-temperature Nylon housing that enable

wave soldering and high-temperature IR reﬂow operations. The socket

latches are reinforced with metal to provide robust module retention and

ejection. They also ensure module ejection forces of no less than those in

2.40 or 3.30mm seating plane sockets. Available in black or white parts, the

sockets are halogen-free.

For more information, visit our website at: www.molex.com/link/ddr3.html.

Features and Beneﬁts

Ultra-low seating plane of 1.10mm height

Frees up vertical module space to allow use of high-

density DIMMs while maintaining the same design

height;

Enables the use of very low-proﬁle modules with

seating heights below 2.80mm (maximum) in ATCA*

blade systems

Low-level contact resistance of 10milliohms

(maximum initial)

Supports the use of Registered DIMM (RDIMM)

modules and reduces power consumption in blade

servers

Reduced latch-actuation angle

Creates more room for neighbouring components

while improving airﬂow space around memory module

socket

High-temperature, glass-ﬁlled socket housing and

Provides robust module retention and ejection; able to

latches

withstand wave solder and IR reﬂow temperatures

Compliance with industry-standard speciﬁcations

Accepts JEDEC MO-269 memory modules

*The Advanced Telecom Computing Architecture (AdvancedTCA or ATCA) speciﬁcations, denoted PICMG † 3.X, are a series of

PICMG speciﬁcations, targeted to requirements for the next generation of ‘carrier grade’ communications equipment. This

series of speciﬁcations incorporates the latest trends in high-speed interconnect technologies, next-generation processors and

improved reliability, manageability and serviceability.

†PCI Industrial Computer Manufacturers Group 3.0 speciﬁcation deﬁnes open architecture modular computing components that

can be quickly integrated to deploy high-performance services solutions.

12 3

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78588-1552 替代型号

型号	品牌	替代类型	描述	数据表
78588-1557	MOLEX	功能相似	Card Edge Connector, 240 Contact(s), 2 Row(s), Straight, 0.039 inch Pitch, Solder Terminal

与78588-1552相关器件

型号	品牌	获取价格	描述	数据表
78588-1557	MOLEX	获取价格	Card Edge Connector, 240 Contact(s), 2 Row(s), Straight, 0.039 inch Pitch, Solder Terminal
78588-1562	MOLEX	获取价格	Ultra-Low-Profile DDR3 DIMM Sockets
78588-1567	MOLEX	获取价格	Card Edge Connector, 240 Contact(s), 2 Row(s), Straight, 0.039 inch Pitch, Solder Terminal
78588-204HLF	AMPHENOL	获取价格	Board Connector, 4 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FREE
78588-206	AMPHENOL	获取价格	Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal
78588-206HLF	AMPHENOL	获取价格	Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FREE
78588-206LF	AMPHENOL	获取价格	Board Connector, 6 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FREE
78588-208HLF	AMPHENOL	获取价格	Board Connector, 8 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FREE
78588-208LF	AMPHENOL	获取价格	Board Connector, 8 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FREE
78588-210HLF	AMPHENOL	获取价格	Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, LEAD FRE

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