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78028-1118 PDF预览

78028-1118

更新时间: 2024-11-09 06:32:07
品牌 Logo 应用领域
莫仕 - MOLEX 连接器集管和边缘连接器PC
页数 文件大小 规格书
2页 259K
描述
PCI Express* Connectors

78028-1118 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:LEAD FREE
Reach Compliance Code:compliant风险等级:5.76
连接器类型:CARD EDGE CONNECTOR联系完成配合:GOLD (15)
联系完成终止:TIN (15)触点性别:FEMALE
触点材料:NOT SPECIFIEDDIN 符合性:NO
滤波功能:NOIEC 符合性:NO
JESD-609代码:e3MIL 符合性:NO
混合触点:NO安装方式:STRAIGHT
安装类型:BOARD装载的行数:1
选件:GENERAL PURPOSE端接类型:PRESS FIT
触点总数:98UL 易燃性代码:94V-0
Base Number Matches:1

78028-1118 数据手册

 浏览型号78028-1118的Datasheet PDF文件第2页 
PCI Express* Connectors  
FEATURES AND SPECIFICATIONS  
Molex’s PCI Express* connector offers greater signaling bandwidths for  
today’s workstation and server applications  
78028  
Vertical Press fit  
PCI Express is a third generation I/O architecture. PCI-SIG* recently  
updated PCI Express specifications to greater signaling bandwidth. Unlike  
the previous version in which the PCI bus is implemented via a multi-drop  
parallel architecture, PCI Express now incorporates a point-to-point  
signaling using differential pairs operating at 2.5 Gbps. PCI Express  
provides adequate bandwidth to support developing I/O such as  
Infiniband and 10G fiber channel.  
Molex’s press fit version of PCI Express provides an alternative for  
customers who require solderless termination on PCBs which have a high  
layer count.  
All Molex PCI Express connectors are compliant with PCI-SIG*  
specifications. For more information on these specifications please see  
www.pcisig.com  
Features and Benefits  
ƒ High-temperature thermoplastic housing for lead-free processing ƒ Complies with PCI-SIG industry specifications ensure connectors  
support all PCI Express module cards available in the market  
Ridge design will be compatible with module cards that require a  
retention clip for secure retention  
ƒ Keying design ensures correct mating of card module to edge card  
connector  
ƒ
ƒ Press fit termination allows solderless termination on high layer  
count PCBs  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
Mechanical  
Max Terminal Retention Force: 2.94 N min/Terminal  
Mating Force: 1.15 N max/contact pair  
Un-Mating Force: 0.15 N min/contact pair  
Durability: 50 Cycles  
UL File No.: Pending  
CSA File No.: Pending  
Mates With : PCI Express®* module card  
Designed In: mm  
Physical  
Electrical  
Voltage: 50 Volts AC (RMS)/DC  
Current: 1.1 Amps/pin  
Contact Resistance: 30 milliohms max  
Dielectric Withstanding Voltage: 500V AC  
Insulation Resistance: 1000 Megohms min  
Housing: High Temperature Nylon, Black, UL 94V-0  
Contact: Copper Alloy  
Plating:  
Contact Area —0.76 µm Gold or 0.38 µm Gold  
Solder Tail Area — Tin  
Underplating — Nickel  
PCB Thickness: See Ordering Tables  
Operating Temperature: - 55 ºC to +85 ºC  
*PCI Express, ExpressModule, and PCI-SIG are trademarks of PIC-SIG  

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