4.00mm (.157”) Pitch
Micro-Max Power™
High-Current Header
FEATURES AND SPECIFICATIONS
Low-profile, high-current Micro-Max Power
header provides versatile solutions in a
compact design
75730 Board-to-Board
Designed for high-current density applications,
Molex’s Micro-Max Power header is soldered directly
to PCBs such as a Voltage Regulator Module (VRM) or
a mother- board using a slotted via. With a current
rating of 16.0A per blade at 30°C T-rise, Micro-Max
Power may be used in any board-to-board application
where power transfer is needed through a non-
separable interface in a compact design.
Left to right: 7, 10, and 15 circuit versions
Micro-Max Power headers are available in circuit
sizes ranging from 4 to 24 blades in a single-row
configuration. Optional voided circuits are available, to
allow for use in high-voltage applications.
Features and Benefits
n 4.17mm (.164“) connector height off the PCB, the
n Compact size improves airflow and saves PCB space
low-profile design enhances system airflow
n Optional voided circuits with design flexibility for
high-voltage applications
n Non-separable interface allows for higher current
and greater density capability with lower resistance
plane-to-plane compared to similar products with
separable interfaces or standard stick headers
n Two blade lengths available to accommodate 1.57
to 2.36mm (.050 to .093”) PCB thicknesses
SPECIFICATIONS
Reference Information
Packaging: Tray
UL File No.: E29179
Designed In: USA
Physical
Housing: LCP
Contact: Copper (Cu) Alloy
Plating:
Solder Tail Area – 100µ” Tin (Sn)
Underplating – 50µ” Nickel (Ni) overall
PCB Thickness:
Mother board – 1.57 to 3.18mm (.062 to .125”)
Daughter Card – 1.27 to 2.36mm (.050 to .093”)
Operating Temperature: -40 to +105°C
Electrical
Voltage: 250V
Current: 16.0A at 30°C T-rise
Insulation Resistance: 5000 Megohms min.
Mechanical
Terminal Retention: 7.78 N (1.75 lbs) min.